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Transactions on Engineering Technologies: World Congress on Engineering 2018

Transactions on Engineering Technologies: World Congress on Engineering 2018

          
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About the Book


About the Author:

Dr. Sio-Iong Ao finished his doctoral research in The University of Hong Kong and postdoctoral researches in the University of Oxford and Harvard University and is a former visiting professor of Cranfield University, UK and University of Wyoming, USA.

Professor Len Gelman is Professor and Chair in Signal Processing and Condition Monitoring, and Director, the Centre for Efficiency and Performance Engineering, School of Computing and Engineering, The University of Huddersfield, UK. He has more than 25 year's experience in signal processing and vibro-acoustic monitoring of complex mechanical systems (e.g. rotating, reciprocating machinery, etc.) both in industry and academia. He has been Principal Investigator on numerous contracts and grants, including grants from the USA National Academy of Sciences, USA National Research Council, USA International Science Foundation, USA Civilian Research and Development Foundation (twice), USA MacArthur Foundation, Lady Davis, Israel, Centro Volta, Italy. He is Principal Investigator on UK EPSRC, UK DTI (three times), UK Royal Society, Rolls Royce (two times) and Shell grants.

Professor Haeng-Kon Kim is a Vice President of Research and Information, a Dean of engineering college and a professor in the Department of Computer Engineering Catholic University of Daegu, in Korea. He has been a research staff member in Bell Lab. and NASA center in U.S.A. Professor Kim is chief editor of KIPS SE-Sig journal and Korea Multimedia Society, an editorial board of KISS (Korea Information Science Society) and a steering committee of KIPS (Korea Information Processing Society).


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Product Details
  • ISBN-13: 9789813295308
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Height: 235 mm
  • No of Pages: 363
  • Spine Width: 0 mm
  • Weight: 888 gr
  • ISBN-10: 9813295309
  • Publisher Date: 09 Jan 2020
  • Binding: Hardback
  • Language: English
  • Returnable: Y
  • Sub Title: World Congress on Engineering 2018
  • Width: 155 mm


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