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Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages

Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages

          
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About the Book

*State-of-the-art techniques for predicting and achieving target performance levels *Theory, practice, general signal integrity issues, and leading-edge experimental techniques Model and simulate high-speed digital systems for maximum performance Maximizing the performance of digital systems means optimizing their high-speed interconnections. Digital Signal Integrity gives engineers all the theory and practical methods they need to accurately model and simulate those interconnections and predict real-world performance. Whether youre modeling microprocessors, memories, DSPs, or ASICs, these techniques will get you to market faster with greater reliability. Coverage includes: *In-depth reviews of inductance, capacitance, resistance, single and multiconductor transmission lines, generalized termination schemes, crosstalk, differential signaling, and other modeling/simulation issues *Multiconductor interconnects: packages, sockets, connectors and buses *Modal decomposition: understanding the outputs generated by commercial modeling software *Layer peeling with time-domain reflectometry: its power and limitations *Experimental techniques for characterizing interconnect parasitics In Dig
About the Author:

BRIAN YOUNG is a Member of the Technical Staff at the Somerset Design Center, Semiconductor Product Sector, Motorola, working on packaging, interconnects, and I/O design for PowerPC microprocessors and the RapidIO Interconnect Architecture. For over seven years he has specialized in simulation, modeling, measurement, and performance studies for high-speed signaling with microprocessors, fast static RAMs, and DSPs. He has served as an Assistant Professor in the Department of Electrical Engineering at Texas A&M University, College Station, and as an adjunct professor in the Department of Electrical Engineering at the University of Texas, Austin. Dr. Young holds a Ph.D from the University of Texas, Austin and holds six patents related to packaging. He has published numerous articles in conferences and journals.


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Product Details
  • ISBN-13: 9780130289049
  • Publisher: Prentice Hall
  • Publisher Imprint: PRENTICE HALL
  • Depth: 25
  • Language: English
  • Returnable: Y
  • Spine Width: 26 mm
  • Weight: 960 gr
  • ISBN-10: 0130289043
  • Publisher Date: 19 Oct 2000
  • Binding: Paperback
  • Height: 244 mm
  • No of Pages: 560
  • Series Title: Prentice Hall Modern Semiconductor Design
  • Sub Title: Modeling and Simulation With Interconnects and Packages
  • Width: 185 mm


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