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Circuits at the Nanoscale: Communications, Imaging, and Sensing

Circuits at the Nanoscale: Communications, Imaging, and Sensing

          
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About the Book

Circuits for Emerging Technologies Beyond CMOS

New exciting opportunities are abounding in the field of body area networks, wireless communications, data networking, and optical imaging. In response to these developments, top-notch international experts in industry and academia present Circuits at the Nanoscale: Communications, Imaging, and Sensing. This volume, unique in both its scope and its focus, addresses the state-of-the-art in integrated circuit design in the context of emerging systems.

A must for anyone serious about circuit design for future technologies, this book discusses emerging materials that can take system performance beyond standard CMOS. These include Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP). Three-dimensional CMOS integration and co-integration with Microelectromechanical (MEMS) technology and radiation sensors are described as well. Topics in the book are divided into comprehensive sections on emerging design techniques, mixed-signal CMOS circuits, circuits for communications, and circuits for imaging and sensing.

Dr. Krzysztof Iniewski is a director at CMOS Emerging Technologies, Inc., a consulting company in Vancouver, British Columbia. His current research interests are in VLSI ciruits for medical applications. He has published over 100 research papers in international journals and conferences, and he holds 18 international patents granted in the United States, Canada, France, Germany, and Japan. In this volume, he has assembled the contributions of over 60 world-reknown experts who are at the top of their field in the world of circuit design, advancing the bank of knowledge for all who work in this exciting and burgeoning area.


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Product Details
  • ISBN-13: 9781420070620
  • Publisher: CRC Press
  • Publisher Imprint: Crc Press
  • Height: 254 mm
  • No of Pages: 602
  • Series Title: Devices, Circuits, and Systems
  • Sub Title: Communications, Imaging, and Sensing
  • Width: 183 mm
  • ISBN-10: 1420070622
  • Publisher Date: 01 Aug 2008
  • Binding: Hardback
  • Language: English
  • Returnable: Y
  • Spine Width: 36 mm
  • Weight: 1305 gr


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