Yufeng Jin

Yufeng JinYuFeng Jin is a Professor at Peking University, China. He also directed the National Key Laboratory of Science and Technology on Micro/Nano Fabrication for a number of years. He received his PhD from Southeast University, China. He has written three ooks on advanced packing technologies, and his research focus includes MEMS sensors and TSV related 3D integration of microsystems. Read More Read Less

6 results found
List viewGrid view
Sort By:
1.
Topology Design of Robot Mechanisms37 %
No Review Yet
₹8,352
₹5,262
Binding:
Paperback
Release:
01 Feb 2019
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Introduction to Microsystem Packaging Technology41 %
Available
Ships within 12-14 Days Explain..
3.
Device-to-Device based Proximity Service41 %
Publisher: CRC Press
No Review Yet
₹21,090
₹12,443
Binding:
Hardback
Release:
01 Oct 2017
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Tsv 3D RF Integration17 % NR
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
5.
Device-to-Device based Proximity Service10 % NR
Publisher: Taylor and Francis
No Review Yet
₹5,096
₹4,586
Binding:
Paperback
Release:
02 Jul 2020
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
6.
Introduction to Microsystem Packaging Technology6 % NR
Publisher: Taylor & Francis
No Review Yet
₹6,630
₹6,232
Binding:
Paperback
Release:
12 Sep 2018
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
No more records found