Yufeng (Peking University) Jin

Yufeng (Peking University) Jin

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1.
Introduction to Microsystem Packaging Technology
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2.
Tsv 3D RF Integration17 % NR
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3.
Introduction to Microsystem Packaging Technology1 % NR
Publisher: Taylor & Francis
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₹6,864
₹6,795
Binding:
Paperback
Release:
12 Sep 2018
Language:
English
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