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Yufeng (Peking University) Jin

Yufeng (Peking University) Jin

3 results found
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1.
Introduction to Microsystem Packaging Technology
Introduction to Microsystem Packaging Technology
By: Yufeng Jin, Zhiping Wang, Jing Chen, Yufeng (Peking University) Jin, Zhiping (Singapore Institute of Manufacturing Tech
Publisher: Taylor & Francis Inc
No Review Yet
₹8,179
Binding:
Hardback
Release:
16 Mar 2010
Language:
English
Available
Ships within 2-4 Days Explain..
2.
Tsv 3D RF Integration17 % NR
Tsv 3D RF Integration
By: Yufeng Jin, Shenglin Ma, Shenglin (Associate Professor, Department of Mechanical and Electrical Engineering, Xiamen University, China) Ma, Yufeng (Professor, Peking University, China) Jin
Publisher: Elsevier Science
No Review Yet
₹22,000
₹18,260
Binding:
Paperback
Release:
01 Jun 2022
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
3.
Introduction to Microsystem Packaging Technology1 % NR
Introduction to Microsystem Packaging Technology
By: Yufeng Jin, Zhiping Wang, Jing Chen, Yufeng (Peking University) Jin, Jing (Peking University) Chen
Publisher: Taylor & Francis
No Review Yet
₹6,864
₹6,795
Binding:
Paperback
Release:
12 Sep 2018
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
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