Humburger Icon
Logo1
Login & Sign up
Bookswagon-24x7 online bookstore
AddBanner
Home icon Home
Account Icon Account
Wishlist Icon Wishlist
Cart Icon Cart
Bookswagon icon Categories
Close

Refine your Search

By Price

Availability

Shipping Time

Source

Binding

Language

Publication Year

Filter By Category
Yufeng (Peking University) Jin

Yufeng (Peking University) Jin

3 results found
List viewGrid view
Sort By:
1.
Introduction to Microsystem Packaging Technology41 %
Introduction to Microsystem Packaging Technology
By: Yufeng Jin, Zhiping Wang, Jing Chen, Yufeng (Peking University) Jin, Zhiping (Singapore Institute of Manufacturing Tech
Publisher: Taylor & Francis Inc
No Review Yet
₹18,315
₹10,806
Binding:
Hardback
Release:
16 Mar 2010
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Tsv 3D RF Integration17 % NR
Tsv 3D RF Integration
By: Yufeng Jin, Shenglin Ma, Shenglin (Associate Professor, Department of Mechanical and Electrical Engineering, Xiamen University, China) Ma, Yufeng (Professor, Peking University, China) Jin
Publisher: Elsevier Science
No Review Yet
₹22,000
₹18,260
Binding:
Paperback
Release:
01 Jun 2022
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
3.
Introduction to Microsystem Packaging Technology33 %
Introduction to Microsystem Packaging Technology
By: Yufeng Jin, Zhiping Wang, Jing Chen, Yufeng (Peking University) Jin, Jing (Peking University) Chen
Publisher: Taylor & Francis
No Review Yet
₹6,864
₹4,599
Binding:
Paperback
Release:
12 Sep 2018
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
No more records found