Yang Xu

Yang XuYang Xu is the Yaoshihua Chair Professor at the School of Computer Science in Fudan University, China. His research interests include software-defined networks, data center networks, distributed machine learning, edge computing, network function virtalization, and network security. Dr. Xu has published more than 100 journal and conference papers and holds more than 10 U.S. and international granted patents on various aspects of networking and computing. He served as a TPC member for many international conferences, as an editor for the Journal of Network and Computer Applications (Elsevier), and as a guest editor for the IEEE Journal on Selected Areas in Communications-Special Series on Network Softwarization & Enablers and Wiley Security and Communication Networks Journal-Special Issue on Network Security and Management in SDN.
Prior to joining Fudan University, he was a research associate professor in the Department of Electrical and Computer Engineering, New York University Tandon School of Engineering.
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Innovative Technologies for Printing, Packaging and Digital Media37 %
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Transactions on Engineering Technologies37 %
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Transactions on Engineering Technologies37 %
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Failure Characteristics Analysis and Fault Diagnosis for Liquid Rocket Engines37 %
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New Energy Power Generation Automation and Intelligent Technology37 %
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New Energy Power Generation Automation and Intelligent Technology37 %
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Sequential Intelligent Dynamic System Modeling and Control37 %
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Innovative Technologies for Printing and Packaging37 %
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Sedimentation and Reservoirs of Marine Shale in South China37 %
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Surgical Techniques of Focused Ultrasound Ablation in Benign Uterine Diseases21 %
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Edge Assisted Mobile Visual Slam37 %
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New Structural Financial Economics27 %
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Performance Analysis and Optimization of Parallel Manipulators37 %
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New Energy Power Generation Automation and Intelligent Technology37 %
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Lectures on China's Traditional Political Thoughts33 %
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Electron Beam Wire Deposition Technology and Its Application37 %
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Rise of Chinese American Leaders in U.S. Higher Education: Stories and Roadmaps37 %
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Interdisciplinary Research for Printing and Packaging37 %
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