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Xingcun Colin Tong

Xingcun Colin Tong

7 results found
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1.
Functional Metamaterials and Metadevices37 %
Functional Metamaterials and Metadevices
By: Xingcun Colin Tong, Xingcun Colin, Ph.D. Tong
Publisher: Springer International Publishing AG
No Review Yet
₹14,880
₹9,374
Binding:
Paperback
Release:
22 Aug 2018
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Functional Metamaterials and Metadevices37 %
Functional Metamaterials and Metadevices
By: Xingcun Colin Tong, Xingcun Colin, Ph.D. Tong
Publisher: Springer
No Review Yet
₹14,880
₹9,374
Binding:
Hardback
Release:
22 Sep 2017
Language:
English
Available
Ships within 12-14 Days Explain..
3.
Advanced Materials for Thermal Management of Electronic Packaging37 %
Advanced Materials for Thermal Management of Electronic Packaging
By: Xingcun Colin Tong, Xingcun Colin, Ph.D. Tong
Publisher: Springer
No Review Yet
₹23,250
₹14,648
Binding:
Hardback
Release:
10 Jan 2011
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Advanced Materials for Integrated Optical Waveguides37 %
Advanced Materials for Integrated Optical Waveguides
By: Xingcun Colin Tong Ph D, Xingcun Colin, Ph.D. Tong, Xingcun Colin Tong Ph.D
Publisher: Springer
No Review Yet
₹13,950
₹8,789
Binding:
Paperback
Release:
23 Aug 2016
Language:
English
Available
Ships within 12-14 Days Explain..
5.
Advanced Materials for Integrated Optical Waveguides59 %
Advanced Materials for Integrated Optical Waveguides
By: Xingcun Colin Tong Ph D, Xingcun Colin, Ph.D. Tong, Xingcun Colin Tong Ph.D
Publisher: Springer
No Review Yet
₹16,740
₹6,863
Binding:
Hardback
Release:
30 Oct 2013
Language:
English
Available
Ships within 1-2 Days Explain..
6.
Advanced Materials and Design for Electromagnetic Interference Shielding41 %
Advanced Materials and Design for Electromagnetic Interference Shielding
By: Colin Tong, Xingcun Colin Tong, Xingcun Tong, Xingcun Colin, Ph.D. Tong, Xingcun Colin, Ph.D. (Laird Technologies, Schaumburg, Illinois, USA) Tong
Publisher: CRC Press
No Review Yet
₹17,760
₹10,478
Binding:
Hardback
Release:
19 Nov 2008
Language:
English
Available
Ships within 12-14 Days Explain..
7.
Advanced Materials for Thermal Management of Electronic Packaging39 % POD/NR
Advanced Materials for Thermal Management of Electronic Packaging
By: Xingcun Colin Tong, Xingcun Colin, Ph.D. Tong
Publisher: Springer
No Review Yet
₹24,000
₹14,640
Binding:
Paperback
Release:
25 Feb 2013
Language:
English
International Edition
Ships within 14-16 Days Explain..
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Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
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