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1.
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging10 % NR
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
By: Xing-Chang Wei
Publisher: Taylor and Francis
No Review Yet
₹5,276
₹4,748
Binding:
Paperback
Release:
02 Jul 2020
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
2.
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging41 %
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
By: Xing-Chang Wei
Publisher: CRC Press
No Review Yet
₹14,430
₹8,514
Binding:
Hardback
Release:
25 May 2017
Language:
English
Available
Ships within 12-14 Days Explain..
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