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William I Ko

William I Ko

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Thermal Buckling Analysis of Rectangular Panels Subjected to Humped Temperature Profile Heating2 % POD/NR
Thermal Buckling Analysis of Rectangular Panels Subjected to Humped Temperature Profile Heating
By: Nasa Technical Reports Server (Ntrs), William I Ko
Publisher: Bibliogov
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₹1,545
₹1,514
Binding:
Paperback
Release:
02 Aug 2013
Language:
English
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Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
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