wei Xing

wei XingDr. Wei Xing is a Professor and Dean at the Advanced Chemical Power Sources, Changchun Institute of Applied Chemistry, Chinese Academy of Sciences (CIAC-CAS). Prof. Xing received his PhD in Electrochemistry from CIAC-CAS in 1987, since then, as one o the key senior researchers, he established, and continues to lead the Laboratory of Advanced Power Sources at CIAC-CAS, that develops novel proton exchange membrane fuel cells (PEMFC) catalysts and technologies. His research is mainly concentrated on the R&D of fuel cell technologies including PEMFCs, direct methanol fuel cells (DMFCs), direct formic acid fuel cells (DFAFCs), in which cathode catalyst development for oxygen reduction reaction is the major focus. To date, he has published more than 160 referred journal papers, 3 books, 39 patents. Dr. Xing's research and scientific contributions are internationally recognized. Read More Read Less

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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and PackagingNR
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Advances in Knowledge Discovery and Data Mining37 %
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Advances in Knowledge Discovery and Data Mining37 %
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Advances in Knowledge Discovery and Data Mining37 %
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Advances in Knowledge Discovery and Data Mining37 %
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Proceedings of the 2012 International Conference on Information Technology and Software Engineering37 %
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Special Topics in Quantum Optics37 %
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Advances in Knowledge Discovery and Data Mining37 %
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Advances in Knowledge Discovery and Data Mining37 %
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Exploring the Cross-Language Transfer of L1 Rhetorical Knowledge in L2 Writing37 %
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New Paradigms in Flow Battery Modelling37 %
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Consensus Over Switching Network Topology: Characterizing System Parameters and Joint Connectivity37 %
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Consensus Over Switching Network Topology: Characterizing System Parameters and Joint Connectivity37 %
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HOW TO GET YOUR MIND ABANDON EXTERNAL ATTACHMENTS : WISDOM OF HUMAN LIFE IN MEDITATION20 %
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Cementitious Materials Science33 %
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Filtering and Control of Stochastic Jump Hybrid Systems37 %
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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging47 %
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Unifying Electrical Engineering and Electronics Engineering37 %
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