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Ulrich Gosele

Ulrich Gosele

3 results found
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1.
Wafer Bonding37 %
Wafer Bonding
By: Marin Alexe, Ulrich Gosele, Ulrich Gösele, Ulrich Goesele
Publisher: Springer
No Review Yet
₹32,550
₹20,507
Binding:
Hardback
Release:
01 Jun 2004
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Wafer Bonding37 %
Wafer Bonding
By: Marin Alexe, Ulrich G. Sele, Ulrich Gosele, Ulrich Gösele, Ulrich Goesele
Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
No Review Yet
₹32,550
₹20,507
Binding:
Paperback
Release:
30 Sep 2011
Language:
English
Available
Ships within 12-14 Days Explain..
3.
Semiconductor Wafer Bonding6 % POD/NR
Semiconductor Wafer Bonding
By: Q.Y. Tong, Ulrich Gosele, Tong, Q -Y Tong, U Gosele
Publisher: Wiley-Interscience
No Review Yet
₹17,596
₹16,540
Binding:
Hardback
Release:
07 Dec 1998
Language:
English
International Edition
Ships within 16-18 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
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