Sven RzepkaSven Rzepka is Head of the Micro Materials Center (MMC) at Fraunhofer ENAS and Professor for 'Smart Systems Reliability' at TU Chemnitz, Germany. He joined Fraunhofer in 2009 after working as Principal Simulation at Qimonda, Backend development, and t Infineon Technologies, BEoL reliability department. In 2002, he graduated from TU Dresden with Diploma, Ph.D., and habilitation degrees. In total, Dr. Rzepka has been working in BEoL and packaging technologies for 30 years with 25 years of experience in microelectronics and smart systems reliability tests, analysis, and simulation. He has published his engineering work in more than 150 papers and technical talks in international journals and at conferences around the world, respectively, and received more than 10 best and outstanding paper awards. He is involved in international conference committees, e.g., of ASME InterPACK, EPoSS Smart Systems Integration, EuroSimE, and organizes the annual European Expert Workshop on Reliability of Electronics and Smart Systems (EuWoRel). Prof. Rzepka is member of IEEE for 22 years, and Euceman for 9 years, and ASME. Serving as member of the Executive Committee of the European Technology Platform EPoSS, he has frequently be involved in evaluation, road mapping, and policy making processes advising European Commission and national authorities. Read More Read Less