Suhir, Ephraim

Suhir, Ephraim

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1.
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices41 %
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2.
Human-in-the-Loop41 %
Publisher: CRC Press
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₹17,205
₹10,151
Binding:
Hardback
Release:
05 Apr 2018
Language:
English
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3.
Structural Analysis in Microelectronic and Fiber-Optic Systems37 %
Publisher: Springer
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₹4,650
₹2,930
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Release:
17 Feb 2012
Language:
English
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4.
Mechanical Behavior of Materials and Structures in Microelectronics: Volume 22638 %
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5.
Moisture Sensitivity of Plastic Packages of IC Devices37 %
Publisher: Springer
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₹23,250
₹14,648
Binding:
Hardback
Release:
19 Jul 2010
Language:
English
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7.
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
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8.
Avoiding Inelastic Strains in Solder Joint Interconnections of IC DevicesNR
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9.
Human-in-the-Loop8 % NR
Publisher: Taylor and Francis
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₹5,456
₹5,020
Binding:
Paperback
Release:
02 Apr 2021
Language:
English
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10.
Structural Dynamics of Electronic and Photonic Systems6 % NR
Publisher: Wiley
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₹18,740
₹17,616
Binding:
Hardback
Release:
03 May 2011
Language:
English
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11.
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging37 %
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12.
Structural Dynamics of Electronic and Photonic Systems4 % NR
Publisher: Wiley
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₹14,440
₹13,929
Binding:
Online resource
Release:
08 Apr 2011
Language:
English
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13.
Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference and Exhibition  Interpack 97;Advances in Electronic Packaging41 % NR
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