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Suhir, Ephraim

Suhir, Ephraim

13 results found
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1.
Structural Analysis in Microelectronic and Fiber-Optic Systems36 %
Structural Analysis in Microelectronic and Fiber-Optic Systems
By: Ephraim Suhir
Publisher: Springer
No Review Yet
₹4,800
₹3,072
Binding:
Paperback
Release:
17 Feb 2012
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Mechanical Behavior of Materials and Structures in Microelectronics: Volume 22653 %
Mechanical Behavior of Materials and Structures in Microelectronics: Volume 226
By: Ephraim Suhir, Robert C Cammarata, Deborah D L Chung, Masahiro Jono
Publisher: Cambridge University Press
No Review Yet
₹3,698
₹1,738
Binding:
Hardback
Release:
01 Jan 1991
Language:
English
Available
Ships within 2-4 Days Explain..
3.
Moisture Sensitivity of Plastic Packages of IC Devices37 %
Moisture Sensitivity of Plastic Packages of IC Devices
By: E. Suhir, X.J. Fan, Ephraim Suhir, X. J. Fan, X J Fan
Publisher: Springer
No Review Yet
₹24,000
₹15,120
Binding:
Hardback
Release:
19 Jul 2010
Language:
English
Available
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4.
Reliability of Photonics Materials and Structures: Symposium Held April 13-16, 1998, San Francisco, California, U.S.A (Materials Research Society Symposium Proceedings)38 %
Reliability of Photonics Materials and Structures: Symposium Held April 13-16, 1998, San Francisco, California, U.S.A (Materials Research Society Symposium Proceedings)
By: Fukuda, Mitsuo, Kurkjian, Charles R., Suhir, Ephraim
Publisher: Materials Research Society
No Review Yet
₹8,698
₹5,393
Binding:
Hardcover
Release:
01-Oct-1998
Language:
English
Available
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5.
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
By: Y.C. Lee, C.P. Wong, Ephraim Suhir, Y C Lee, C P Wong
Publisher: Springer
No Review Yet
₹4,382
Binding:
Hardback
Release:
01 Oct 2006
Language:
English
Available
Ships within 1-2 Days Explain..
6.
Avoiding Inelastic Strains in Solder Joint Interconnections of IC DevicesNR
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
By: Ephraim Suhir, Ephraim (Portland State University, Portland, USA) Suhir
Publisher: Taylor & Francis Ltd
No Review Yet
₹6,554
Binding:
Paperback
Release:
04 Oct 2024
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
7.
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices2 % POD/NR
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
By: Ephraim Suhir, Ephraim (Portland State University, Portland, USA) Suhir
Publisher: Taylor and Francis
No Review Yet
₹17,825
₹17,469
Binding:
Hardback
Release:
28 Jan 2021
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
8.
Human-in-the-Loop1 % NR
Human-in-the-Loop
By: Ephraim Suhir, Ephraim (Portland State University, Portland, USA) Suhir
Publisher: Taylor and Francis
No Review Yet
₹5,634
₹5,578
Binding:
Paperback
Release:
02 Apr 2021
Language:
English
International Edition
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Free Shipping in India and low cost Worldwide.
9.
Human-in-the-LoopPOD/NR
Human-in-the-Loop
By: Ephraim Suhir, Ephraim (Portland State University, Portland, USA) Suhir
Publisher: CRC Press
No Review Yet
₹18,372
Binding:
Hardback
Release:
05 Apr 2018
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
10.
Structural Dynamics of Electronic and Photonic Systems7 % NR
Structural Dynamics of Electronic and Photonic Systems
By: Eric Connally, Ephraim Suhir, David S. Steinberg, T. X. Yu , T X Yu
Publisher: Wiley
No Review Yet
₹18,970
₹17,642
Binding:
Hardback
Release:
03 May 2011
Language:
English
International Edition
Ships within 24-26 Days Explain..
Free Shipping in India and low cost Worldwide.
11.
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging37 %
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
By: Y.C. Lee, C.P. Wong, Ephraim Suhir, C.P. Wong (Editor), Ephraim Suhir (Editor)
Publisher: Springer
No Review Yet
₹48,000
₹30,240
Binding:
Paperback
Release:
23 Aug 2016
Language:
English
Out of Stock
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12.
Structural Dynamics of Electronic and Photonic Systems4 % NR
Structural Dynamics of Electronic and Photonic Systems
By: Ephraim Suhir, T X Yu, David S Steinberg
Publisher: Wiley
No Review Yet
₹14,440
₹13,929
Binding:
Online resource
Release:
08 Apr 2011
Language:
English
Out of Stock
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13.
Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference and Exhibition Interpack 97;Advances in Electronic Packaging43 % NR
Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference and Exhibition Interpack 97;Advances in Electronic Packaging
By: Au, Ephraim Suhir, M. Shiratori
Publisher: American Society Of Mechanical Engineers,u.s.
No Review Yet
₹50,963
₹29,049
Binding:
Hardback
Release:
15 Jun 1997
Out of Stock
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