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Shyam P Murarka

Shyam P Murarka

6 results found
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1.
Interlayer Dielectrics for Semiconductor Technologies
Interlayer Dielectrics for Semiconductor Technologies
By: Shyam Muraka, Ashok K Sinha, Moshe Eizenberg, S P Murarka, Shyam P Murarka
Publisher: Academic Press
No Review Yet
₹3,946
Binding:
Hardback
Release:
30 Dec 2003
Language:
English
Available
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2.
Advanced Metallizations in Microelectronics: Volume 18138 %
Advanced Metallizations in Microelectronics: Volume 181
By: Ami Appelbaum, Avishay Katz, Shyam P Murarka, Shyam P. (Rensselaer Polytechnic Institute, New York) Murarka, Avishay (AT&T Bell Laboratories, New Jersey) Katz
Publisher: Cambridge University Press
No Review Yet
₹3,575
₹2,217
Binding:
Hardback
Release:
12 Sep 1990
Language:
English
Available
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3.
Advanced Metallization and Processing for Semiconductor Devices and Circuits -- II: Volume 26038 %
Advanced Metallization and Processing for Semiconductor Devices and Circuits -- II: Volume 260
By: Avishay Katz, James M E Harper, Shyam P Murarka, Yves I Nissim
Publisher: Cambridge University Press
No Review Yet
₹3,575
₹2,217
Binding:
Hardback
Release:
28 Oct 1992
Language:
English
Available
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4.
Advanced Metallizations in Microelectronics9 % POD/NR
Advanced Metallizations in Microelectronics
By: Ami Appelbaum, Avishay Katz, Shyam P Murarka, Shyam P. (Rensselaer Polytechnic Institute, New York) Murarka, Avishay (AT&T Bell Laboratories, New Jersey) Katz
Publisher: Cambridge University Press
No Review Yet
₹2,940
₹2,675
Binding:
Paperback
Release:
05 Jun 2014
Language:
English
International Edition
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Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
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5.
Chemical Mechanical Planarization of Microelectronic Materials4 % NR
Chemical Mechanical Planarization of Microelectronic Materials
By: Joseph M Steigerwald, Shyam P Murarka, Ronald J Gutmann
Publisher: Wiley
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₹16,359
₹15,771
Binding:
Online resource
Release:
21 Dec 2007
Language:
English
Out of Stock
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6.
Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits: Volume 514NR
Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits: Volume 514
By: Raymond T. Tung, Moshe Eizenberg, David B. Fraser, Roland Madar, Shyam P Murarka
Publisher: Materials Research Society
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₹2,199
Binding:
Hardback
Release:
02 Nov 1998
Language:
English
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