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Shawon Alam

Shawon Alam

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1.
New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation36 %
New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation
By: Nabil Shovon Ashraf, Shawon Alam, Mohaiminul Alam
Publisher: Springer International Publishing AG
No Review Yet
₹2,688
₹1,720
Binding:
Paperback
Release:
16 Feb 2016
Language:
English
Available
Ships within 12-14 Days Explain..
2.
New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation30 % POD/NR
New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation
By: Nabil Shovon Ashraf, Shawon Alam, Mohaiminul Alam
Publisher: Morgan & Claypool
No Review Yet
₹2,765
₹1,936
Binding:
Paperback
Release:
19 Feb 2016
Language:
English
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Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
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