Seonho Seok

Seonho Seok

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1.
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering37 %
Publisher: Springer
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₹13,440
₹8,467
Binding:
Paperback
Release:
05 Jan 2019
Language:
English
Available
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2.
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering37 %
Publisher: Springer
No Review Yet
₹13,440
₹8,467
Binding:
Hardback
Release:
14 May 2018
Language:
English
Available
Ships within 12-14 Days Explain..
3.
MEMS Packaging Technologies and 3D Integration24 % NR
Publisher: Mdpi AG
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₹6,202
₹4,714
Binding:
Hardback
Release:
01 Jun 2022
Language:
English
International Edition
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4.
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering3 % NR
No Review Yet
₹4,239
₹4,112
Binding:
Paperback
Release:
03 May 2018
Language:
English
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