Humburger Icon
Logo1
Login & Sign up
Bookswagon-24x7 online bookstore
AddBanner
Home icon Home
Account Icon Account
Wishlist Icon Wishlist
Cart Icon Cart
Bookswagon icon Categories
Close

Refine your Search

By Price

Availability

Shipping Time

Source

Binding

Language

Publication Year

Filter By Category
Seok Seonho Seok

Seok Seonho Seok

4 results found
List viewGrid view
Sort By:
1.
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering37 %
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
By: Seonho Seok
Publisher: Springer
No Review Yet
₹13,440
₹8,467
Binding:
Paperback
Release:
05 Jan 2019
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering37 %
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
By: Seonho Seok
Publisher: Springer
No Review Yet
₹13,440
₹8,467
Binding:
Hardback
Release:
14 May 2018
Language:
English
Available
Ships within 12-14 Days Explain..
3.
MEMS Packaging Technologies and 3D Integration24 % NR
MEMS Packaging Technologies and 3D Integration
By: Seonho Seok
Publisher: Mdpi AG
No Review Yet
₹6,365
₹4,837
Binding:
Hardback
Release:
01 Jun 2022
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
4.
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering3 % NR
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
By: Seok Seonho Seok
Publisher: Springer Nature B.V.
No Review Yet
₹4,239
₹4,112
Binding:
Paperback
Release:
03 May 2018
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
No more records found