Rao Tummala

Rao TummalaDr. Rao Tummala (Atlanta, GA) is Pettit Chair Professor and Director of the Packaging Research Center at Georgia Tech. He is a past-President of ISHM, an IEEE Fellow, and the General Chair of IEEE-ICTC. He was recently named by Industry Week as one o the 50 Stars in the US for improving national competitiveness. Read More Read Less

6 results found
List viewGrid view
Sort By:
1.
Fundamentals of Device and Systems Packaging: Technologies and Applications, Second EditionNR
No Review Yet
₹20,333
Binding:
Hardback
Release:
02 Sep 2019
Language:
English
International Edition
Ships within 16-18 Days Explain..
Free Shipping in India and low cost Worldwide.
3.
Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition
Out of Stock
Notify me when this book is in stockNotify Me
4.
Fundamentals of Microsystems Packaging10 % NR
No Review Yet
₹11,969
₹10,798
Binding:
Hardback
Release:
29 May 2001
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
5.
Microelectronics Packaging Handbook9 % NR
Out of Stock
Notify me when this book is in stockNotify Me
6.
Microelectronics Packaging Fundamentals19 % NR
Publisher: Chapman and Hall
No Review Yet
₹5,423
₹4,393
Binding:
Hardback
Release:
01 Mar 1998
Out of Stock
Notify me when this book is in stockNotify Me
No more records found