Rao Tummala

Rao TummalaDr. Rao Tummala (Atlanta, GA) is Pettit Chair Professor and Director of the Packaging Research Center at Georgia Tech. He is a past-President of ISHM, an IEEE Fellow, and the General Chair of IEEE-ICTC. He was recently named by Industry Week as one o the 50 Stars in the US for improving national competitiveness. Read More Read Less

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Fundamentals of Device and Systems Packaging: Technologies and Applications, Second EditionNR
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₹20,100
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Release:
02 Sep 2019
Language:
English
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Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition
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Fundamentals of Microsystems Packaging10 % NR
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₹11,969
₹10,798
Binding:
Hardback
Release:
29 May 2001
Language:
English
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Microelectronics Packaging Handbook9 % NR
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Microelectronics Packaging Fundamentals19 % NR
Publisher: Chapman and Hall
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₹5,423
₹4,393
Binding:
Hardback
Release:
01 Mar 1998
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