Rajiv JoshiDr. Rajiv V. Joshi is a research staff member and key technical lead at T. J. Watson research center, IBM. He received his B.Tech I.I.T (Bombay, India), M.S (M.I.T) and Dr. Eng. Sc. (Columbia University). His novel interconnects processes and structues for aluminum, tungsten and copper technologies which are widely used in IBM for various technologies from sub-0.5μm to 14nm. He has led successfully predictive failure analytic techniques for yield prediction and also the technology-driven SRAM at IBM Server Group. He has extensively worked on novel memory designs. He commercialized these techniques. He received 3 Outstanding Technical Achievement (OTAs), 3 highest Corporate Patent Portfolio awards for licensing contributions, holds 60 invention plateaus and has over 235 US patents and over 354 including international patents. His interests are in in-memory computation, CNN, DNN accelerators and Quantum computing. He has authored and co-authored over 200 papers. He has given over 45 invited/keynote talks and given several Seminars. He is awarded prestigious IEEE Daniel Noble award for 2018. He received the Best Editor Award from IEEE TVLSI journal. He is recipient of 2015 BMM award. He is inducted into New Jersey Inventor Hall of Fame in Aug 2014 along with pioneer Nicola Tesla. He is a recipient of 2013 IEEE CAS Industrial Pioneer award and 2013 Mehboob Khan Award from Semiconductor Research Corporation. He is a member of IBM Academy of technology and a master inventor. He served as a Distinguished Lecturer for IEEE CAS and EDS society. He is currently Distinguished Lecturer for CEDA. He is IEEE, ISQED and World Technology Network fellow and distinguished alumnus of IIT Bombay. He serves in the Board of Governors for IEEE CAS as industrial liaison. He serves as an Associate Editor of TVLSI. He will and has served on committees of DAC 2019, AICAS 2019, ISCAS, ISLPED (Int. Symposium Low Power Electronic Design), IEEE VLSI design, IEEE CICC, IEEE Int. SOI conference, ISQED and Advanced Metallization Program committees. He initiated IBM CAS EDS symposium at IBM in 2017 and will continue into 2018 with Artificial Intelligence as the focal area. He served as a general chair for IEEE ISLPED. He is an industry liaison for universities as a part of the Semiconductor Research Corporation. Also he is in the industry liaison committee for IEEE CAS society. Read More Read Less