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R. R. Tummala

R. R. Tummala

16 results found
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1.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: R. R. Tummala, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala, Eugene J Rymaszewski
Publisher: Springer
No Review Yet
₹19,200
₹12,096
Binding:
Paperback
Release:
23 Oct 2012
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Microelectronics Packaging Handbook on CD-ROM
Microelectronics Packaging Handbook on CD-ROM
By: R. R. Tummala, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala, Eugene J Rymaszewski
Publisher: Springer
No Review Yet
₹3,618
Binding:
CD-ROM
Release:
31 Mar 1998
Language:
English
Available
Ships within 1-2 Days Explain..
3.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala
Publisher: Springer
No Review Yet
₹19,200
₹12,096
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala
Publisher: Springer
No Review Yet
₹14,400
₹9,072
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 12-14 Days Explain..
5.
Sources and Expressions of Resiliency in Trauma Survivors47 %
Sources and Expressions of Resiliency in Trauma Survivors
By: Mary R. (EDT) Harvey, Pratyusha, Ph.D. (EDT) Tummala-Nara, Mary R. Harvey, Pratyusha Tummala-Narra, Mary R Harvey
Publisher: Taylor & Francis Inc
No Review Yet
₹5,216
₹2,764
Binding:
Paperback
Release:
15 Mar 2007
Language:
English
Available
Ships within 12-14 Days Explain..
6.
Electronic Packaging for High Reliability, Low Cost Electronics37 %
Electronic Packaging for High Reliability, Low Cost Electronics
By: Marija Kosec, R. R. Tummala, Darko Belavic, W.K. Jones, R R Tummala
Publisher: Springer
No Review Yet
₹14,400
₹9,072
Binding:
Hardback
Release:
29 Feb 2000
Language:
English
Available
Ships within 12-14 Days Explain..
7.
Electronic Packaging for High Reliability, Low Cost Electronics37 %
Electronic Packaging for High Reliability, Low Cost Electronics
By: Marija Kosec, R. R. Tummala, Darko Belavic, W.K. Jones, R R Tummala
Publisher: Springer
No Review Yet
₹14,400
₹9,072
Binding:
Paperback
Release:
03 Dec 2010
Language:
English
Available
Ships within 12-14 Days Explain..
8.
Microelectronics Packaging Handbook3 % POD/NR
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala
Publisher: Springer
No Review Yet
₹32,549
₹31,573
Binding:
Paperback
Release:
31 Jan 1997
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
9.
System on PackagePOD/NR
System on Package
By: Rao Tummala, Madhavan Swaminathan, Rao R Tummala
Publisher: McGraw-Hill Education
No Review Yet
₹14,023
Binding:
Hardback
Release:
01 Apr 2007
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
10.
Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition
Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition
By: Tummala, Rao R.
No Review Yet
₹861
Binding:
Paperback
Language:
English
Out of Stock
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11.
Sources and Expressions of Resiliency in Trauma Survivors44 %
Sources and Expressions of Resiliency in Trauma Survivors
By: Mary R. Harvey, Pratyusha Tummala-Narra, Mary R Harvey
Publisher: Routledge
No Review Yet
₹15,300
₹8,568
Binding:
Hardback
Release:
27 Mar 2007
Language:
English
Out of Stock
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12.
Microelectronics Packaging HandbookNR
Microelectronics Packaging Handbook
By: Tummala R.R. Tummala, Klopfenstein Alan G. Klopfenstein, Rymaszewski Eugene J. Rymaszewski
Publisher: Springer Nature B.V.
No Review Yet
₹4,299
Binding:
Paperback
Release:
14 May 2012
Language:
English
Out of Stock
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13.
Microelectronics Packaging Fundamentals19 % NR
Microelectronics Packaging Fundamentals
By: R. R. Tummala, E.J. Rymaszewski, Rao R. Tummala, A.G. Klopfenstein
Publisher: Chapman and Hall
No Review Yet
₹5,423
₹4,393
Binding:
Hardback
Release:
01 Mar 1998
Out of Stock
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14.
Microelectronics Packaging Handbook9 % NR
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Rao R. Tummala, Eugene J. Pymaszewski
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹6,840
₹6,228
Binding:
Hardback
Release:
15 Sep 1996
Out of Stock
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15.
Microelectronics Packaging Handbook, 3-Part SetNR
Microelectronics Packaging Handbook, 3-Part Set
By: R R Tummala, Eugene J Rymaszewski, Alan G Klopfenstein
Publisher: Springer
No Review Yet
₹42,926
Binding:
Book
Release:
31 Jan 1997
Language:
English
Out of Stock
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16.
Microelectronics Packaging Handbook19 % NR
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, I. Turlik
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹7,099
₹5,750
Binding:
Hardcover
Release:
01 Jan 1996
Language:
English
Out of Stock
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