· FLAT 10% Off (Maximum Discount Rs.50) Use Code - BWSPECIAL10

· Grab Bestselling Books upto 50% Off!

· FLAT 10% Off (Maximum Discount Rs.50) Use Code - BWSPECIAL10

· Grab Bestselling Books upto 50% Off!

· FLAT 10% Off (Maximum Discount Rs.50) Use Code - BWSPECIAL10

· Grab Bestselling Books upto 50% Off!

Humburger Icon
Logo1
Login & Sign up
Bookswagon-24x7 online bookstore
AddBanner
Home icon Home
Account Icon Account
Wishlist Icon Wishlist
Cart Icon Cart
Bookswagon icon Categories
Close

Refine your Search

By Price

Availability

Shipping Time

Source

Binding

Language

Publication Year

Filter By Category
R R Tummala

R R Tummala

16 results found
List viewGrid view
Sort By:
1.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: R. R. Tummala, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala, Eugene J Rymaszewski
Publisher: Springer
No Review Yet
₹19,200
₹12,096
Binding:
Paperback
Release:
23 Oct 2012
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Microelectronics Packaging Handbook on CD-ROM
Microelectronics Packaging Handbook on CD-ROM
By: R. R. Tummala, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala, Eugene J Rymaszewski
Publisher: Springer
No Review Yet
₹3,618
Binding:
CD-ROM
Release:
31 Mar 1998
Language:
English
Available
Ships within 1-2 Days Explain..
3.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala
Publisher: Springer
No Review Yet
₹14,400
₹9,072
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala
Publisher: Springer
No Review Yet
₹19,200
₹12,096
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 12-14 Days Explain..
5.
Sources and Expressions of Resiliency in Trauma Survivors41 %
Sources and Expressions of Resiliency in Trauma Survivors
By: Mary R. (EDT) Harvey, Pratyusha, Ph.D. (EDT) Tummala-Nara, Mary R. Harvey, Pratyusha Tummala-Narra, Mary R Harvey
Publisher: Taylor & Francis Inc
No Review Yet
₹5,216
₹3,077
Binding:
Paperback
Release:
15 Mar 2007
Language:
English
Available
Ships within 12-14 Days Explain..
6.
Electronic Packaging for High Reliability, Low Cost Electronics37 %
Electronic Packaging for High Reliability, Low Cost Electronics
By: Marija Kosec, R. R. Tummala, Darko Belavic, W.K. Jones, R R Tummala
Publisher: Springer
No Review Yet
₹14,400
₹9,072
Binding:
Hardback
Release:
29 Feb 2000
Language:
English
Available
Ships within 12-14 Days Explain..
7.
Electronic Packaging for High Reliability, Low Cost Electronics37 %
Electronic Packaging for High Reliability, Low Cost Electronics
By: Marija Kosec, R. R. Tummala, Darko Belavic, W.K. Jones, R R Tummala
Publisher: Springer
No Review Yet
₹14,400
₹9,072
Binding:
Paperback
Release:
03 Dec 2010
Language:
English
Available
Ships within 12-14 Days Explain..
8.
Microelectronics Packaging Handbook3 % POD/NR
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala
Publisher: Springer
No Review Yet
₹32,549
₹31,573
Binding:
Paperback
Release:
31 Jan 1997
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
9.
System on PackagePOD/NR
System on Package
By: Rao Tummala, Madhavan Swaminathan, Rao R Tummala
Publisher: McGraw-Hill Education
No Review Yet
₹14,023
Binding:
Hardback
Release:
01 Apr 2007
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
10.
Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition
Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition
By: Tummala, Rao R.
No Review Yet
₹861
Binding:
Paperback
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
11.
Sources and Expressions of Resiliency in Trauma Survivors33 %
Sources and Expressions of Resiliency in Trauma Survivors
By: Mary R. Harvey, Pratyusha Tummala-Narra, Mary R Harvey
Publisher: Routledge
No Review Yet
₹15,300
₹10,251
Binding:
Hardback
Release:
27 Mar 2007
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
12.
Microelectronics Packaging HandbookNR
Microelectronics Packaging Handbook
By: Tummala R.R. Tummala, Klopfenstein Alan G. Klopfenstein, Rymaszewski Eugene J. Rymaszewski
Publisher: Springer Nature B.V.
No Review Yet
₹4,299
Binding:
Paperback
Release:
14 May 2012
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
13.
Microelectronics Packaging Fundamentals19 % NR
Microelectronics Packaging Fundamentals
By: R. R. Tummala, E.J. Rymaszewski, Rao R. Tummala, A.G. Klopfenstein
Publisher: Chapman and Hall
No Review Yet
₹5,423
₹4,393
Binding:
Hardback
Release:
01 Mar 1998
Out of Stock
Notify me when this book is in stockNotify Me
14.
Microelectronics Packaging Handbook9 % NR
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Rao R. Tummala, Eugene J. Pymaszewski
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹6,840
₹6,228
Binding:
Hardback
Release:
15 Sep 1996
Out of Stock
Notify me when this book is in stockNotify Me
15.
Microelectronics Packaging Handbook, 3-Part SetNR
Microelectronics Packaging Handbook, 3-Part Set
By: R R Tummala, Eugene J Rymaszewski, Alan G Klopfenstein
Publisher: Springer
No Review Yet
₹42,926
Binding:
Book
Release:
31 Jan 1997
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
16.
Microelectronics Packaging Handbook19 % NR
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, I. Turlik
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹7,099
₹5,750
Binding:
Hardcover
Release:
01 Jan 1996
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
No more records found