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Paul S Ho

Paul S HoPaul Ho is Professor Emeritus in the Department of Mechanical Engineering and the Texas Materials Institute at the University of Texas at Austin. He has received research awards from the Electrochemical Society, IEEE, IITC and Semiconductor Industry ssociation, among others. Read More Read Less

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1.
Electromigration in Metals33 %
Electromigration in Metals
By: Valeriy Sukharev, Martin Gall, Paul S. (University of Texas, Austin) Ho, Paul S Ho, Chao-Kun Hu
Publisher: Cambridge University Press
No Review Yet
₹8,422
₹5,643
Binding:
Hardback
Release:
12 May 2022
Language:
English
Available
Ships within 2-4 Days Explain..
2.
Low Dielectric Constant Materials for IC Applications37 %
Low Dielectric Constant Materials for IC Applications
By: Paul S. Ho, Wei William Lee, Jihperng Leu, Paul S Ho
Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
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₹14,400
₹9,072
Binding:
Paperback
Release:
04 Oct 2012
Language:
English
Available
Ships within 12-14 Days Explain..
3.
Stress-Induced Phenomena in Metallization
Stress-Induced Phenomena in Metallization
By: Eduard Arzt, Paul S Ho, Shefford P Baker, Matti A Korhonen
Publisher: American Institute of Physics
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₹1,327
Binding:
Hardback
Release:
09 Apr 2002
Language:
English
Available
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4.
Low Dielectric Constant Materials for IC Applications37 %
Low Dielectric Constant Materials for IC Applications
By: W. W. Lee, P. S. Ho, Paul S. Ho, Wei William Lee, Jihperng Leu
Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
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₹14,400
₹9,072
Binding:
Hardback
Release:
14 Nov 2002
Language:
English
Available
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5.
Materials Reliability in Microelectronics III: Volume 30937 %
Materials Reliability in Microelectronics III: Volume 309
By: William F. Filter, Paul S. (University of Texas, Austin) Ho, Harold J. (Dartmouth College, New Hampshire) Frost, Harold J Frost, Kenneth P Rodbell
Publisher: Cambridge University Press
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₹2,806
₹1,768
Binding:
Hardback
Release:
31 Aug 1993
Language:
English
Available
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6.
Advanced Interconnects for ULSI Technology43 %
Advanced Interconnects for ULSI Technology
By: Mikhail Baklanov, Ehrenfried Zschech, Mikhail R. Baklanov, Paul S. Ho, Paul S Ho
Publisher: Wiley
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₹21,570
₹12,295
Binding:
Hardback
Release:
02 Apr 2012
Language:
English
Available
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7.
Materials Reliability in Microelectronics III: Volume 30914 % POD/NR
Materials Reliability in Microelectronics III: Volume 309
By: William F. Filter, Paul S. (University of Texas, Austin) Ho, Harold J. (Dartmouth College, New Hampshire) Frost, Harold J Frost, Kenneth P Rodbell
Publisher: Cambridge University Press
No Review Yet
₹2,975
₹2,559
Binding:
Paperback
Release:
05 Jun 2014
Language:
English
International Edition
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Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
8.
Electronic Packaging Materials Science V: Volume 20311 %
Electronic Packaging Materials Science V: Volume 203
By: Paul S. Ho, Edwin D. Lillie, Ralph Jaccodine, Kenneth Jackson, Ralph J. Jaccodine
Publisher: Cambridge University Press
No Review Yet
₹2,260
₹2,011
Binding:
Hardback
Release:
07 Jun 1991
Language:
English
Out of Stock
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9.
Stress-Induced Phenomena in MetallizationNR
Stress-Induced Phenomena in Metallization
By: Paul Totta, Paul Tuha, Che-Yu Li, C y Li, Paul S Ho
Publisher: American Institute of Physics
No Review Yet
₹10,585
Binding:
Hardback
Release:
14 Apr 2000
Language:
English
Out of Stock
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10.
Materials Reliability Issues in Microelectronics: Volume 225NR
Materials Reliability Issues in Microelectronics: Volume 225
By: James R. Lloyd, Paul S. (IBM T J Watson Research Center, New York) Ho, Frederick G. Yost, James R Lloyd, Paul S Ho
Publisher: Cambridge University Press
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₹2,664
Binding:
Hardback
Release:
22 Oct 1991
Language:
English
Out of Stock
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11.
Electronic Packaging Materials Science IX: Volume 445NR
Electronic Packaging Materials Science IX: Volume 445
By: Steven K. Groothuis, Kenzo Ishida, Paul S. (University of Texas, Austin) Ho, Tien Wu, Paul S Ho
Publisher: Materials Research Society
No Review Yet
₹2,134
Binding:
Hardback
Release:
20 Oct 1997
Language:
English
Out of Stock
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12.
Stress-Induced Phenomena in MetallizationNR
Stress-Induced Phenomena in Metallization
By: John Sanchez, Che-Yu Li, John Bravman, Paul S Ho
Publisher: American Institute of Physics
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₹12,315
Binding:
Hardback
Release:
15 Apr 1998
Language:
English
Out of Stock
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13.
Stress-Induced Phenomena in MetallizationNR
Stress-Induced Phenomena in Metallization
By: Tomoji Nakamura, Cynthia A Volkert, Paul S Ho, Shefford P Baker
Publisher: American Institute of Physics
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₹11,956
Binding:
Hardback
Release:
01 Dec 2004
Language:
English
Out of Stock
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14.
Stress-Induced Phenomena in Metallization73 % NR
Stress-Induced Phenomena in Metallization
By: Ehrenfried Zschech, Shinichi Ogawa, Paul S Ho
Publisher: American Institute of Physics
No Review Yet
₹10,164
₹2,744
Binding:
Hardback
Release:
01 Jun 2009
Language:
English
Out of Stock
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15.
Electronic Packaging Materials Science VI: Volume 264NR
Electronic Packaging Materials Science VI: Volume 264
By: Che-Yu Li, Che-Yu (Cornell University, New York) Li, Paul S. (University of Texas, Austin) Ho, Kenneth A. (University of Arizona) Jackson, G. Ferris Lipscomb
Publisher: Materials Research Society
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₹2,172
Binding:
Hardback
Release:
12 Nov 1992
Language:
English
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