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Michael Pecht

Michael PechtMichael Pecht is an IEEE Fellow, an ASME Fellow, and an SAE Fellow. He is the Director of CALCE (Center for Advanced Life Cycle Engineering) and a Chair Professor at the University of Maryland.

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1.
Influence of Temperature on Microelectronics and System Reliability
Influence of Temperature on Microelectronics and System Reliability
By: Michael Pecht, Edward B. Hakim, Michael G. Pecht, Pradeep Lall, Michael G Pecht
Publisher: CRC Press
No Review Yet
₹4,521
Binding:
Hardback
Release:
24 Apr 1997
Language:
English
Available
Ships within 2-4 Days Explain..
2.
The Korean Electronics Industry7 % NR
The Korean Electronics Industry
By: Pramod C. Karulkar, Joseph B. Bernstein, Damion Searls, Michael Pecht, Martin Peckerar
Publisher: CRC Press
No Review Yet
₹6,072
₹5,647
Binding:
Paperback
Release:
06 Feb 1997
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
3.
Lead-free Electronics5 % POD/NR
Lead-free Electronics
By: Sanka Ganesan, Ganesan, Michael G. Pecht, Michael G Pecht, Pecht
Publisher: Wiley-Interscience
No Review Yet
₹16,452
₹15,629
Binding:
Hardback
Release:
01 Mar 2006
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
4.
Handbook of Electronic Package Design
Handbook of Electronic Package Design
By: Pecht Pecht, Michael Pecht, Michael (University of Maryland, College Park, USA) Pecht, Lynn (Battelle, Columbus, Ohio, USA) Faulkner, Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht
Publisher: Taylor & Francis Inc
No Review Yet
₹14,686
Binding:
Hardback
Release:
16 Aug 1991
Language:
English
Available
Ships within 2-4 Days Explain..
5.
Risk-Based Engineering37 %
Risk-Based Engineering
By: Michael G. Pecht, Prabhakar V. Varde, Michael G Pecht, Prabhakar V Varde, Michael G (University of Maryland) Pecht
Publisher: Springer
No Review Yet
₹8,370
₹5,273
Binding:
Paperback
Release:
19 Jan 2019
Language:
English
Available
Ships within 12-14 Days Explain..
6.
Risk-Based Engineering37 %
Risk-Based Engineering
By: Michael G. Pecht, Prabhakar V. Varde, Michael G Pecht, Prabhakar V Varde
Publisher: Springer
No Review Yet
₹12,090
₹7,617
Binding:
Hardback
Release:
24 Aug 2018
Language:
English
Available
Ships within 12-14 Days Explain..
7.
Reliability Engineering29 % POD/NR
Reliability Engineering
By: Kapur, Kailash C Kapur, Michael Pecht, Kailash C. Kapur, Pecht
Publisher: Wiley
No Review Yet
₹13,812
₹9,807
Binding:
Hardback
Release:
28 Apr 2014
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
8.
Placement and Routing of Electronic Modules49 %
Placement and Routing of Electronic Modules
By: Pecht Pecht, Michael Pecht, Michael G Pecht, Michael (University of Maryland, College Park, USA) Pecht, M Pecht
Publisher: CRC Press
No Review Yet
₹29,588
₹15,090
Binding:
Hardback
Release:
12 Mar 1993
Language:
English
Available
Ships within 2-4 Days Explain..
9.
Parts Selection and Management
Parts Selection and Management
By: Michael Pecht, Pecht, MG Pecht, Michael (University of Wisconsin-Madison; University of Maryland) Pecht, Michael G. (University of Wisconsin-Madison; University of Maryland) Pecht
Publisher: Wiley-Interscience
No Review Yet
₹7,956
Binding:
Hardback
Release:
28 Jan 2004
Language:
English
Available
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10.
Guidebook for Managing Silicon Chip Reliability
Guidebook for Managing Silicon Chip Reliability
By: Michael Pecht, Riko Radojcic, Gopal Rao, Michael G. Pecht, Michael (University of Maryland, College Park, USA) Pecht
Publisher: Taylor & Francis Inc
No Review Yet
₹4,149
Binding:
Hardback
Release:
29 Dec 1998
Language:
English
Available
Ships within 2-4 Days Explain..
11.
Product Reliability, Maintainability, and Supportability Handbook
Product Reliability, Maintainability, and Supportability Handbook
By: Michael Pecht, Michael (University of Maryland, College Park, USA) Pecht, Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht
Publisher: CRC Press
No Review Yet
₹3,673
Binding:
Hardback
Release:
01 Apr 2009
Language:
English
Available
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12.
IC Component Sockets48 %
IC Component Sockets
By: Michael Pecht, Weifeng Liu, W Liu, Michael (CALCE EPSC) Pecht, Weifeng (Hewlett Packard) Liu
Publisher: Wiley-Interscience
No Review Yet
₹11,388
₹5,922
Binding:
Hardback
Release:
25 Mar 2004
Language:
English
Available
Ships within 4-6 Days Explain..
13.
Prognostics and Health Management of Electronics43 %
Prognostics and Health Management of Electronics
By: Michael G. Pecht, Michael G Pecht
Publisher: Wiley-Interscience
No Review Yet
₹15,693
₹8,945
Binding:
Hardback
Release:
01 Aug 2008
Language:
English
Available
Ships within 4-6 Days Explain..
14.
Long-Term Non-Operating Reliability of Electronic Products41 %
Long-Term Non-Operating Reliability of Electronic Products
By: Au, Michael Pecht, Judy Pecht, Michael (University of Maryland, College Park, USA) Pecht, Judy (University of Maryland, College Park, Maryland, USA) Pecht
Publisher: CRC Press
No Review Yet
₹16,095
₹9,496
Binding:
Hardback
Release:
13 Dec 2017
Language:
English
Available
Ships within 12-14 Days Explain..
15.
Encapsulation Technologies for Electronic Applications43 %
Encapsulation Technologies for Electronic Applications
By: Haleh Ardebili, Michael Pecht, Michael G Pecht, Michael (CALCE (Center for Advanced Life Cycle Engineering), University of Maryland, USA) Pecht, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University) Ardebili
Publisher: William Andrew
No Review Yet
₹18,389
₹10,482
Binding:
Hardback
Release:
01 Jun 2009
Language:
English
Available
Ships within 4-6 Days Explain..
16.
Assembly Processes33 %
Assembly Processes
By: Richard Crowson, Michael Pecht, John P Tanner, Richard (Clanton, AL, USA) Crowson, Vijay Sheth
Publisher: CRC Press
No Review Yet
₹11,124
₹7,453
Binding:
Hardback
Release:
13 Jan 2006
Language:
English
Available
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17.
Electronics Industry in Taiwan59 %
Electronics Industry in Taiwan
By: Chung-Shing Lee, Michael Pecht, Lee Chung-Shing
Publisher: CRC Press
No Review Yet
₹5,008
₹2,053
Binding:
Paperback
Release:
09 Feb 1997
Language:
English
Available
Ships within 1-2 Days Explain..
18.
Singapore and Malaysia Electronics Industries43 %
Singapore and Malaysia Electronics Industries
By: Donald Beane, Pecht Michael G., Anand Shukla
Publisher: CRC Press
No Review Yet
₹3,338
₹1,903
Binding:
Paperback
Release:
1997
Language:
English
Available
Ships within 4-6 Days Explain..
19.
Contamination of Electronic Assemblies41 %
Contamination of Electronic Assemblies
By: Au, Elissa M. Bumiller, Joan Pecht, Michael Pecht, Elissa M. (University of Maryland Bumiller
Publisher: Taylor & Francis Inc
No Review Yet
₹27,750
₹16,373
Binding:
Hardback
Release:
12 Nov 2002
Language:
English
Available
Ships within 12-14 Days Explain..
20.
Japanese Electronics Industry41 %
Japanese Electronics Industry
By: Watura Nakayama, Wataru Nakayama, Michael Pecht, William Boulton, Michael (University of Maryland, College Park, USA) Pecht
Publisher: CRC Press
No Review Yet
₹11,655
₹6,876
Binding:
Paperback
Release:
27 Jun 1999
Language:
English
Available
Ships within 12-14 Days Explain..
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