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Michael M Pecht
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1.
59
%
Influence of Temperature on Microelectronics and System Reliability
By:
Michael Pecht
,
Edward B. Hakim
,
Michael G. Pecht
,
Pradeep Lall
,
Michael G Pecht
Publisher:
CRC Press
No Review Yet
₹12,892
₹5,286
Binding:
Hardback
Release:
24 Apr 1997
Language:
English
Available
Ships within
4-6 Days
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2.
9
%
POD/NR
Lead-Free Electronics
By:
Sanka Ganesan
,
Ganesan
,
Michael G. Pecht
,
Michael G Pecht
,
Pecht
Publisher:
Wiley-Interscience
No Review Yet
₹15,979
₹14,541
Binding:
Hardback
Release:
01 Mar 2006
Language:
English
International Edition
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18-20 Days
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Free Shipping in India and low cost Worldwide.
Print On Demand (POD) titles :
are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles :
are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
3.
37
%
Risk-Based Engineering
By:
Michael G. Pecht
,
Prabhakar V. Varde
,
Michael G Pecht
,
Prabhakar V Varde
,
Michael G (University of Maryland) Pecht
Publisher:
Springer
No Review Yet
₹8,640
₹5,443
Binding:
BC
Release:
19 Jan 2019
Language:
eng
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4.
62
%
POD/NR
Risk-Based Engineering
By:
Michael G. Pecht
,
Prabhakar V. Varde
,
Michael G Pecht
,
Prabhakar V Varde
Publisher:
Springer
No Review Yet
₹12,209
₹4,639
Binding:
BB
Release:
24 Aug 2018
Language:
eng
International Edition
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10-12 Days
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Print On Demand (POD) titles :
are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles :
are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
5.
49
%
Placement and Routing of Electronic Modules
By:
Pecht Pecht
,
Michael Pecht
,
Michael G Pecht
,
Michael (University of Maryland, College Park, USA) Pecht
,
M Pecht
Publisher:
CRC Press
No Review Yet
₹29,146
₹14,864
Binding:
Hardback
Release:
12 Mar 1993
Language:
English
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2-4 Days
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6.
59
%
Guidebook for Managing Silicon Chip Reliability
By:
Michael Pecht
,
Riko Radojcic
,
Gopal Rao
,
Michael G. Pecht
,
Michael (University of Maryland, College Park, USA) Pecht
Publisher:
Taylor & Francis Inc
No Review Yet
₹11,771
₹4,826
Binding:
Hardback
Release:
29 Dec 1998
Language:
English
Available
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4-6 Days
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7.
33
%
Encapsulation Technologies for Electronic Applications
By:
Haleh Ardebili
,
Michael Pecht
,
Michael G Pecht
,
Michael (CALCE (Center for Advanced Life Cycle Engineering), University of Maryland, USA) Pecht
,
Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University) Ardebili
Publisher:
William Andrew
No Review Yet
₹16,965
₹11,367
Binding:
Hardback
Release:
01 Jun 2009
Language:
English
Available
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2-4 Days
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8.
43
%
Singapore and Malaysia Electronics Industries
By:
Donald Beane
,
Pecht Michael G.
,
Anand Shukla
Publisher:
CRC Press
No Review Yet
₹3,362
₹1,916
Binding:
Paperback
Release:
1997
Language:
English
Available
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4-6 Days
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9.
43
%
Contamination of Electronic Assemblies
By:
Au
,
Elissa M. Bumiller
,
Joan Pecht
,
Michael Pecht
,
Elissa M. (University of Maryland Bumiller
Publisher:
Taylor & Francis Inc
No Review Yet
₹26,640
₹15,185
Binding:
Hardback
Release:
12 Nov 2002
Language:
English
Available
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12-14 Days
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10.
37
%
Optimum Cooling of Data Centers
By:
Diganta Das
,
Diganta Bhusan Das
,
Michael G. Pecht
,
Michael M. Ohadi
,
Jun Dai
Publisher:
Springer
No Review Yet
₹9,600
₹6,048
Binding:
Hardback
Release:
21 Nov 2013
Language:
English
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12-14 Days
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11.
37
%
Optimum Cooling of Data Centers
By:
Diganta Das
,
Diganta Bhusan Das
,
Michael G. Pecht
,
Michael M. Ohadi
,
Jun Dai
Publisher:
Springer
No Review Yet
₹9,600
₹6,048
Binding:
Paperback
Release:
20 Aug 2016
Language:
English
Available
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12-14 Days
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12.
37
%
Copper Wire Bonding
By:
Zhaowei Zhong
,
Zhaowei W. Zhong
,
Michael G. Pecht
,
Preeti S. Chauhan
,
Anupam Choubey
Publisher:
Springer-Verlag New York Inc.
No Review Yet
₹12,480
₹7,862
Binding:
Paperback
Release:
23 Aug 2016
Language:
English
Available
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12-14 Days
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13.
33
%
Copper Wire Bonding
By:
Zhaowei Zhong
,
Zhaowei W. Zhong
,
Michael G. Pecht
,
Preeti S. Chauhan
,
Anupam Choubey
Publisher:
Springer
No Review Yet
₹11,363
₹7,613
Binding:
Hardback
Release:
20 Sep 2013
Language:
English
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2-4 Days
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14.
43
%
Electronic Packaging Materials and Their Properties
By:
Patrick McCluskey
,
Rakesh Agarwal
,
Michael G. (EDT) Pecht
,
Terrance Dishongh
,
Sirus Javadpour
Publisher:
Taylor & Francis Inc
No Review Yet
₹16,650
₹9,491
Binding:
Hardback
Release:
18 Dec 1998
Language:
English
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15.
14
%
NR
Nature-Inspired Computing Paradigms in Systems
By:
Michael Pecht
,
Mohamed Arezki Mellal
,
Michael G Pecht
,
Michael (CALCE (Center for Advanced Life Cycle Engineering), University of Maryland, USA) Pecht
,
Michael M Pecht
Publisher:
Elsevier Science
No Review Yet
₹10,427
₹8,967
Binding:
Paperback
Release:
01 Jul 2021
Language:
English
International Edition
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18-20 Days
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16.
10
%
NR
Electrical Connectors
By:
Michael G. Pecht
,
Michael G Pecht
,
San Kyeong
,
S Kyeong
,
Michael G. (University of Maryland) Pecht
Publisher:
Wiley
No Review Yet
₹12,760
₹11,484
Binding:
Hardback
Release:
29 Dec 2020
Language:
English
International Edition
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18-20 Days
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17.
33
%
POD/NR
Guidebook for Managing Silicon Chip Reliability
By:
Michael Pecht
,
Riko Radojcic
,
Gopal Rao
,
Michael G. Pecht
,
Michael G Pecht
Publisher:
Taylor and Francis
No Review Yet
₹6,659
₹4,462
Binding:
Paperback
Release:
07 Oct 2019
Language:
English
International Edition
Ships within
18-20 Days
Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand (POD) titles :
are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles :
are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
18.
32
%
NR
Influence of Temperature on Microelectronics and System Reliability
By:
Michael Pecht
,
Edward B. Hakim
,
Michael G. Pecht
,
Pradeep Lall
,
Michael G Pecht
Publisher:
Taylor and Francis
No Review Yet
₹6,659
₹4,528
Binding:
Paperback
Release:
21 Jun 2019
Language:
English
International Edition
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18-20 Days
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19.
13
%
POD/NR
Prognostics and Health Management of Electronics
By:
Michael G. Pecht
,
Myeongsu Kang
,
Michael G Pecht
,
MG Pecht
,
Michael G. (University of Maryland) Pecht
Publisher:
Wiley-IEEE Press
No Review Yet
₹14,425
₹12,550
Binding:
Hardback
Release:
01 Oct 2018
Language:
English
International Edition
Ships within
14-16 Days
Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand (POD) titles :
are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles :
are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
20.
POD/NR
Encapsulation Technologies for Electronic Applications
By:
Haleh Ardebili
,
Michael Pecht
,
Michael G Pecht
,
James J Licari
,
Jiawei Zhang
Publisher:
William Andrew
No Review Yet
₹22,143
Binding:
Paperback
Release:
11 Oct 2018
Language:
English
International Edition
Ships within
14-16 Days
Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand (POD) titles :
are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles :
are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
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