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Michael G. (University of Maryland, College Park, USA) Pecht

Michael G. (University of Maryland, College Park, USA) Pecht

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1.
Placement and Routing of Electronic Modules49 %
Placement and Routing of Electronic Modules
By: Pecht Pecht, Michael Pecht, Michael G Pecht, Michael (University of Maryland, College Park, USA) Pecht, M Pecht
Publisher: CRC Press
No Review Yet
₹29,146
₹14,864
Binding:
Hardback
Release:
12 Mar 1993
Language:
English
Available
Ships within 2-4 Days Explain..
2.
Guidebook for Managing Silicon Chip Reliability54 %
Guidebook for Managing Silicon Chip Reliability
By: Michael Pecht, Riko Radojcic, Gopal Rao, Michael G. Pecht, Michael (University of Maryland, College Park, USA) Pecht
Publisher: Taylor & Francis Inc
No Review Yet
₹11,771
₹5,415
Binding:
Hardback
Release:
29 Dec 1998
Language:
English
Available
Ships within 4-6 Days Explain..
3.
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines15 % POD/NR
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
By: Michael Pecht, Pecht, M Pecht, Michael G. (University of Maryland, College Park, USA) Pecht
Publisher: Wiley-Interscience
No Review Yet
₹18,101
₹15,386
Binding:
Hardback
Release:
01 Mar 1994
Language:
English
International Edition
Ships within 14-16 Days Explain..
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Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
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