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Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht

Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht

10 results found
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1.
Handbook of Electronic Package Design54 %
Handbook of Electronic Package Design
By: Pecht Pecht, Michael Pecht, Michael (University of Maryland, College Park, USA) Pecht, Lynn (Battelle, Columbus, Ohio, USA) Faulkner, Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht
Publisher: Taylor & Francis Inc
No Review Yet
₹41,738
₹19,199
Binding:
Hardback
Release:
16 Aug 1991
Language:
English
Available
Ships within 4-6 Days Explain..
2.
Product Reliability, Maintainability, and Supportability Handbook59 %
Product Reliability, Maintainability, and Supportability Handbook
By: Michael Pecht, Michael (University of Maryland, College Park, USA) Pecht, Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht
Publisher: CRC Press
No Review Yet
₹17,252
₹7,073
Binding:
Hardback
Release:
01 Apr 2009
Language:
English
Available
Ships within 1-2 Days Explain..
3.
Placement and Routing of Electronic Modules49 %
Placement and Routing of Electronic Modules
By: Pecht Pecht, Michael Pecht, Michael G Pecht, Michael (University of Maryland, College Park, USA) Pecht, M Pecht
Publisher: CRC Press
No Review Yet
₹28,938
₹14,758
Binding:
Hardback
Release:
12 Mar 1993
Language:
English
Available
Ships within 2-4 Days Explain..
4.
Guidebook for Managing Silicon Chip Reliability54 %
Guidebook for Managing Silicon Chip Reliability
By: Michael Pecht, Riko Radojcic, Gopal Rao, Michael G. Pecht, Michael (University of Maryland, College Park, USA) Pecht
Publisher: Taylor & Francis Inc
No Review Yet
₹11,687
₹5,376
Binding:
Hardback
Release:
29 Dec 1998
Language:
English
Available
Ships within 4-6 Days Explain..
5.
Long-Term Non-Operating Reliability of Electronic Products41 %
Long-Term Non-Operating Reliability of Electronic Products
By: Au, Michael Pecht, Judy Pecht, Michael (University of Maryland, College Park, USA) Pecht, Judy (University of Maryland, College Park, Maryland, USA) Pecht
Publisher: CRC Press
No Review Yet
₹16,095
₹9,496
Binding:
Hardback
Release:
13 Dec 2017
Language:
English
Available
Ships within 12-14 Days Explain..
6.
Japanese Electronics Industry41 %
Japanese Electronics Industry
By: Watura Nakayama, Wataru Nakayama, Michael Pecht, William Boulton, Michael (University of Maryland, College Park, USA) Pecht
Publisher: CRC Press
No Review Yet
₹11,655
₹6,876
Binding:
Paperback
Release:
27 Jun 1999
Language:
English
Available
Ships within 12-14 Days Explain..
7.
Electronics Industry in Taiwan3 % NR
Electronics Industry in Taiwan
By: Chung-Shing Lee, Michael Pecht, Michael (University of Maryland, College Park, USA) Pecht, Chung-Shing (Pacific Lutheran University, Tacoma, Washington, USA) Lee, Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht
Publisher: Taylor & Francis
No Review Yet
₹19,360
₹18,779
Binding:
Hardback
Release:
18 Dec 2020
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
8.
Placement and Routing of Electronic Modules7 % POD/NR
Placement and Routing of Electronic Modules
By: Michael Pecht, Michael (University of Maryland, College Park, USA) Pecht, Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht
Publisher: Taylor and Francis
No Review Yet
₹7,304
₹6,793
Binding:
Paperback
Release:
05 Sep 2019
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
9.
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines17 % POD/NR
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
By: Michael Pecht, Pecht, M Pecht, Michael G. (University of Maryland, College Park, USA) Pecht
Publisher: Wiley-Interscience
No Review Yet
₹18,740
₹15,554
Binding:
Hardback
Release:
01 Mar 1994
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
10.
Japanese Electronics Industry27 %
Japanese Electronics Industry
By: Wataru Nakayama, Michael Pecht, William Boulton, Michael (University of Maryland, College Park, USA) Pecht, Wataru (ThermTech International, Kanagawa, Japan) Nakayama
Publisher: CRC Press
No Review Yet
₹14,413
₹10,521
Binding:
Hardback
Release:
28 Jun 2018
Language:
English
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