Ling LiaoDr. Liao Ling is an Intel Fellow and chief architect of photonic integration in Intel's Silicon Photonic Product Division. She joined Intel in 1997 and spearheaded pioneering research in high speed silicon modulation, optical transmitter integration,and now co-packaged optics. Her worked played a big part in transforming Silicon Photonics from being a niche technical interest 20 years ago to the now key enabling technology that is revolutionizing data center connectivity. Ling currently leads the development of multi terabit per second photonic engines to co-package optics with switch SOCs and XPUs for future power, cost, and bandwidth density scaling.

Ling is the recipient of two Intel Achievement Awards (2004 and 2017), the 2006 MIT Technology Review Innovator Under 35 Award, and the 2014 Optical Society Paul F. Forman Engineering Excellence Team Award. She has authored chapters in four books as well as over 50 journal and conference papers. She has nine issued patents and three pending. Ling earned her bachelor's and master's degrees in materials science and engineering from the Massachusetts Institute of Technology and PhD degree in electrical engineering from the University of Surrey, England. Read More Read Less