Kuan Yew Cheong

Kuan Yew CheongAs a passionate researcher, educator, trainer, consultant, and Professional Engineer of material science and engineering for more than twenty years, Kuan Yew CHEONG is a full Professor at the School of Materials and Mineral Resources Engineering, Uniersiti Sains Malaysia, Malaysia. Prof. Cheong served as a Commissioned Senior Scientist at Korea Electrotechnology Research Institute (2004, 2006), Adjunct Associate Professor at Multimedia University, Malaysia (2012), Visiting Lecturer at Universiti Malaysia Perlis (2012), Malaysia, Visiting Professor at National Taiwan University (2018), MIMOS Semiconductor Sdn Bhd (2018), and Technical Advisor for NTG Innovation Pte. Ltd., Singapore (January - December 2019). Now, he is an External Examiner for Wawasan Open University (Malaysia), INTI International College Penang (Malaysia), affiliated to Innovation Centre for Clean Water and Sustainable Energy (WISE), National Tsing Hua University, Taiwan (November 2018 to October 2021), Technical Consultant of failure analysis for MIMOS Semiconductor Sdn Bhd (Malaysia), and Editor of "Materials Science in Semiconductor Processing", Elsevier (since 2015).
Kuan Yew Cheong has published approximate 200 high impact-factor journals, 6 reputable book chapters, 3 edited books, and 1 granted Malaysian Patent (MY-153033-A), which in-line with his research direction of solving environmental and energy related issue through the development of advanced oxide based on wide bandgap semiconductor and exploring the potential of utilizing natural organic materials to produce "all-natural" electronic devices. As a registered Professional Engineer (Board of Engineers, Malaysia), a "Top Research Scientists Malaysia (TRSM) 2013" (Academy of Sciences Malaysia), and a Certified Professional Trainer (Ministry of Human Resource, Malaysia), Prof. Cheong has delivered more than 250 technical training courses to various local and multinational industries and has resolved many industrial cases related to processing of electronic materials both wafer and package levels. Currently, Prof. Cheong is a Fellow of The Institution of Engineers Malaysia (IEM), Senior Member of Institute of Electrical, Electronic Engineers (IEEE), a Principle Interviewer for Professional Interview of IEM and Senior Evaluation Panel of Engineering Program Accreditation under Engineering Accreditation Council, Malaysia.
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