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Kit Lee

Kit Lee

18 results found
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1.
Hong Kong Media37 %
Hong Kong Media
By: Gary Tang, Francis L F Lee, Chi Kit Chan
Publisher: Springer Nature Singapore
No Review Yet
₹11,520
₹7,258
Binding:
Paperback
Release:
26 Aug 2023
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Hong Kong Media37 %
Hong Kong Media
By: Gary Tang, Francis L. F. Lee, Francis L F Lee, Chi Kit Chan
Publisher: Springer Verlag, Singapore
No Review Yet
₹11,520
₹7,258
Binding:
Hardback
Release:
12 Aug 2022
Language:
English
Available
Ships within 12-14 Days Explain..
3.
Computer-Aided Design and VLSI Device Development37 %
Computer-Aided Design and VLSI Device Development
By: Keunmyung Lee, Paul Vandevoorde, Soo-Young Oh, Kit Man Cham, John L Moll
Publisher: Springer
No Review Yet
₹14,400
₹9,072
Binding:
Hardback
Release:
31 Oct 1988
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Computer-Aided Design and VLSI Device Development37 %
Computer-Aided Design and VLSI Device Development
By: Keunmyung Lee, Paul Vandevoorde, Soo-Young Oh, Kit Man Cham, John L Moll
Publisher: Springer
No Review Yet
₹14,400
₹9,072
Binding:
Paperback
Release:
10 Nov 2011
Language:
English
Available
Ships within 12-14 Days Explain..
5.
Mathematical Modelling: From Theory to Practice48 %
Mathematical Modelling: From Theory to Practice
By: Ngan Hoe Lee, Dawn Kit Ee Ng, Kit Ee Dawn Ng, Ngan Hoe (Nie, Ntu, S'pore) Lee, Kit Ee Dawn (Nie, Ntu, S'pore) Ng
Publisher: World Scientific Publishing Company
No Review Yet
₹9,371
₹4,873
Binding:
Hardback
Release:
13 Mar 2015
Language:
English
Available
Ships within 1-2 Days Explain..
6.
Taiwan and Southeast Asia8 % NR
Taiwan and Southeast Asia
By: Ying-Kit Chan, Karl Chee Leong (Institute of China Studies, University of Malaya, Malaysia.) Lee, Ying-kit (National University of Singapore, Singapore) Chan, Karl Chee Leong Lee, Karl Chee Leong (Universiti Malaya, Malaysia) Lee
Publisher: Taylor & Francis Ltd
No Review Yet
₹4,675
₹4,301
Binding:
Paperback
Release:
28 Nov 2024
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
7.
Taiwan and Southeast Asia8 % NR
Taiwan and Southeast Asia
By: Ying-Kit Chan, Karl Chee Leong (Institute of China Studies, University of Malaya, Malaysia.) Lee, Ying-kit (National University of Singapore, Singapore) Chan, Karl Chee Leong Lee, Karl Chee Leong (Universiti Malaya, Malaysia) Lee
Publisher: Taylor & Francis Ltd
No Review Yet
₹15,300
₹14,076
Binding:
Hardback
Release:
16 Jun 2023
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
8.
Liquid Biphasic System16 % POD/NR
Liquid Biphasic System
By: Pau Loke Show, Kit Wayne Chew, Pau-Loke Show, Sze Ying Lee, Kit Wayne (Department of Chemical and Environmental Engineering, Faculty of Engineering, University of Nottingham Malaysia - Semenyih, Selangor, Malaysia) Chew
Publisher: Elsevier
No Review Yet
₹20,073
₹16,861
Binding:
Paperback
Release:
02 Dec 2020
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
9.
Department of Startup26 % POD/NR
Department of Startup
By: Sam Lee, Ivan Yong Wei Kit
Publisher: Business Expert Press
No Review Yet
₹2,335
₹1,728
Binding:
Paperback
Release:
29 Apr 2019
Language:
English
International Edition
Ships within 16-18 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
10.
Emerging Food Packaging Technologies25 % POD/NR
Emerging Food Packaging Technologies
By: Dong Sun Lee, Kit L Yam, Kit L (Rutgers University, USA) Yam, Dong Sun (Kyungnam University, South Korea) Lee
Publisher: Woodhead Publishing
No Review Yet
₹23,800
₹17,850
Binding:
Paperback
Release:
19 Aug 2016
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
11.
Food Packaging Science and Technology7 % POD/NR
Food Packaging Science and Technology
By: Dong Sun Lee, Luciano Piergiovanni, Kit L. Yam, Kit L Yam, Dong Sun (Kyungnam University, Masan, South Korea) Lee
Publisher: CRC Press
No Review Yet
₹13,600
₹12,648
Binding:
Hardback
Release:
01 Mar 2008
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
12.
Emerging Food Packaging Technologies: Principles And Practices43 %
Emerging Food Packaging Technologies: Principles And Practices
By: Dong Sun Lee Kit L. Yam
Publisher: Bio-Green Elsevier (Exc)
No Review Yet
₹3,995
₹2,277
Binding:
Hardback
Release:
2015
Language:
English
Out of Stock
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13.
Emerging Food Packaging Technologies: Principles and Practice26 %
Emerging Food Packaging Technologies: Principles and Practice
By: Kit L. (EDT) Yam, K. L. Yam, D. S. Lee, K. L. (EDT) Yam, D. S. (EDT) Lee
Publisher: Elsevier Science & Technology
No Review Yet
₹18,844
₹13,945
Binding:
Hardcover
Release:
29 Mar 2012
Language:
English
Out of Stock
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14.
Hong Kong Media2 % NR
Hong Kong Media
By: Lee Francis L. F. Lee, Chan Chi Kit Chan, Tang Gary Tang
Publisher: Springer Nature B.V.
No Review Yet
₹4,239
₹4,154
Binding:
Paperback
Release:
12 Aug 2022
Language:
English
Out of Stock
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15.
Food Packaging Science and Technology, Second Edition8 % NR
Food Packaging Science and Technology, Second Edition
By: Dong Sun Lee, Dong Sun (Kyungnam University, Masan, South Korea) Lee, Kit L. (Rutgers University, New Brunswick, New Jersey, USA) Yam, Luciano (University of Milan, Italy) Piergiovanni
Publisher: CRC Press
No Review Yet
₹7,315
₹6,696
Binding:
Hardback
Release:
15 Apr 2019
Out of Stock
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16.
Adorn29 % NR
Adorn
By: Kit Lee, Shini Park
Publisher: Hardie Grant Books
No Review Yet
₹1,580
₹1,128
Binding:
HARDCOVER
Release:
27 Mar 2014
Language:
English
Out of Stock
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17.
A Study on Identity Formation of Physically Handicapped Adolescents and Its Implications for Social Work InterventionNR
A Study on Identity Formation of Physically Handicapped Adolescents and Its Implications for Social Work Intervention
By: Kit-Hung Theresa Lee, 李潔紅
Publisher: Open Dissertation Press
No Review Yet
₹4,701
Binding:
Paperback
Language:
English
Out of Stock
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18.
Tracks29 % NR
Tracks
By: Marian Hosking, Claudia Terstappen, Kit Wise, Ihn-Bum Lee
Publisher: Monash University Publishing
No Review Yet
₹1,676
₹1,190
Binding:
Paperback
Release:
01 May 2006
Language:
English
Out of Stock
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