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1.
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments47 %
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
By: Jeremiah Gayle, Joshua Ravich, Juan Cepeda-Rizo
Publisher: Taylor & Francis
No Review Yet
₹11,099
₹5,882
Binding:
Hardback
Release:
15 Dec 2021
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments7 % NR
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
By: Jeremiah Gayle, Joshua Ravich, Juan Cepeda-Rizo
Publisher: Taylor & Francis Ltd
No Review Yet
₹5,270
₹4,901
Binding:
Paperback
Release:
26 Aug 2024
Language:
English
International Edition
Ships within 18-20 Days Explain..
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