Joshua Ravich

Joshua Ravich

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1.
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments41 %
Publisher: Taylor & Francis
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₹13,570
₹8,006
Binding:
Hardback
Release:
15 Dec 2021
Language:
English
Available
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2.
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments4 % NR
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₹5,404
₹5,188
Binding:
Paperback
Release:
26 Aug 2024
Language:
English
International Edition
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