John Lau

John LauJohn H. Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, ITRI Fellow, spent 30 years in the electronics industry (HP and Agilent) in Palo Alto, California, and currently serves as a fellow at the Electronics & Optoelectronics Laboratories, Industral Technology Research Institute (ITRI), Taiwan. He has published 16 books with McGraw-Hill, including Reliability of RoHS-Compliant 2D and 3D IC Interconnects, Advanced MEMS Packaging, Electronics Manufacturing with Lead-Free Solders and Low Cost Flip Chip Technologies. Read More Read Less

62 results found
List viewGrid view
Sort By:
1.
Basics Fashion Design 09: Designing Accessories26 %
5.0 (1)
₹1,299
₹961
Binding:
Paperback
Release:
03 Oct 2019
Language:
English
Available
Ships within 2-4 Days Explain..
2.
Classical Chinese Literature: An Anthology of Translations24 % NR
No Review Yet
₹5,625
₹4,275
Binding:
Paperback
Release:
27 Mar 2002
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
3.
Chiplet Design and Heterogeneous Integration Packaging37 %
No Review Yet
₹11,520
₹7,258
Binding:
Paperback
Release:
29 Mar 2024
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Phoenix Omnibus Vol. 231 % NR
Publisher: Marvel
No Review Yet
₹12,750
₹8,798
Binding:
Hardback
Release:
19 Sep 2023
Language:
English
International Edition
Ships within 10-12 Days Explain..
Free Shipping in India and low cost Worldwide.
5.
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology37 %
No Review Yet
₹16,320
₹10,282
Binding:
Hardback
Release:
18 Aug 2024
Language:
English
Available
Ships within 12-14 Days Explain..
6.
Chiplet Design and Heterogeneous Integration Packaging37 %
No Review Yet
₹16,320
₹10,282
Binding:
Hardback
Release:
28 Mar 2023
Language:
English
Available
Ships within 12-14 Days Explain..
7.
Semiconductor Advanced Packaging38 %
No Review Yet
₹10,454
₹6,481
Binding:
Paperback
Release:
19 May 2022
Language:
English
In Stock
Ships within 1-2 Days Explain..
8.
Semiconductor Advanced Packaging37 %
Publisher: Springer
No Review Yet
₹15,360
₹9,677
Binding:
Hardback
Release:
02 Aug 2021
Language:
English
Available
Ships within 12-14 Days Explain..
9.
Assembly and Reliability of Lead-Free Solder Joints37 %
Publisher: Springer
No Review Yet
₹11,040
₹6,955
Binding:
Paperback
Release:
13 Jun 2021
Language:
English
Available
Ships within 12-14 Days Explain..
10.
Assembly and Reliability of Lead-Free Solder Joints37 %
Publisher: Springer
No Review Yet
₹15,360
₹9,677
Binding:
Hardback
Release:
30 May 2020
Language:
English
Available
Ships within 12-14 Days Explain..
11.
Media Culture in Transnational Asia33 %
No Review Yet
₹13,950
₹9,347
Binding:
Hardback
Release:
17 Sep 2020
Language:
English
Available
Ships within 14-16 Days Explain..
12.
Media Culture in Transnational Asia32 %
No Review Yet
₹3,262
₹2,218
Binding:
Paperback
Release:
17 Sep 2020
Language:
English
Available
Ships within 14-16 Days Explain..
13.
Heterogeneous Integrations37 %
Publisher: Springer
No Review Yet
₹14,400
₹9,072
Binding:
Hardback
Release:
12 Apr 2019
Language:
English
Available
Ships within 12-14 Days Explain..
14.
Fan-Out Wafer-Level Packaging37 %
Publisher: Springer
No Review Yet
₹9,600
₹6,048
Binding:
Paperback
Release:
16 Dec 2018
Language:
English
Available
Ships within 12-14 Days Explain..
15.
Fan-Out Wafer-Level Packaging37 %
Publisher: Springer
No Review Yet
₹13,440
₹8,467
Binding:
Hardback
Release:
10 May 2018
Language:
English
Available
Ships within 12-14 Days Explain..
16.
Through-Silicon Vias for 3D Integration48 %
No Review Yet
₹14,175
₹7,371
Binding:
Hardback
Release:
11 Oct 2012
Language:
English
Available
Ships within 1-2 Days Explain..
17.
Reliability of RoHS-Compliant 2D and 3D IC Interconnects48 %
No Review Yet
₹12,775
₹6,643
Binding:
Hardback
Release:
22 Dec 2010
Language:
English
Available
Ships within 1-2 Days Explain..
18.
Thermal Stress and Strain in Microelectronics Packaging37 %
Publisher: Springer
No Review Yet
₹14,400
₹9,072
Binding:
Paperback
Release:
30 Apr 2012
Language:
English
Available
Ships within 12-14 Days Explain..
19.
Solder Joint Reliability37 %
Publisher: Springer
No Review Yet
₹19,200
₹12,096
Binding:
Hardback
Release:
31 May 1991
Language:
English
Available
Ships within 12-14 Days Explain..
20.
Solder Joint Reliability37 %
Publisher: Springer
No Review Yet
₹19,200
₹12,096
Binding:
Paperback
Release:
23 Feb 2014
Language:
English
Available
Ships within 12-14 Days Explain..
loadingLoading more results