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John H Lau

John H LauJohn Lau, Ph.D., is both an ASME and an IEEE fellow. He has written 17engineering books, published more than 425 peer-reviewed papers, and given 290lectures, workshops, and keynotes worldwide.

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1.
Chiplet Design and Heterogeneous Integration Packaging37 %
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau, John H Lau
Publisher: Springer Nature Singapore
No Review Yet
₹11,520
₹7,258
Binding:
Paperback
Release:
29 Mar 2024
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology37 %
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
By: John H. Lau, John H Lau
Publisher: Springer Nature Singapore
No Review Yet
₹16,320
₹10,282
Binding:
Hardback
Release:
18 Aug 2024
Language:
English
Available
Ships within 12-14 Days Explain..
3.
Chiplet Design and Heterogeneous Integration Packaging37 %
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau, John H Lau
Publisher: Springer Nature Singapore
No Review Yet
₹16,320
₹10,282
Binding:
Hardback
Release:
28 Mar 2023
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Semiconductor Advanced Packaging39 %
Semiconductor Advanced Packaging
By: John H. Lau, John H Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹10,559
₹6,441
Binding:
Paperback
Release:
19 May 2022
Language:
English
In Stock
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5.
Semiconductor Advanced Packaging37 %
Semiconductor Advanced Packaging
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹15,360
₹9,677
Binding:
Hardback
Release:
02 Aug 2021
Language:
English
Available
Ships within 12-14 Days Explain..
6.
Assembly and Reliability of Lead-Free Solder Joints37 %
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee, John H Lau
Publisher: Springer
No Review Yet
₹11,040
₹6,955
Binding:
Paperback
Release:
13 Jun 2021
Language:
English
Available
Ships within 12-14 Days Explain..
7.
Assembly and Reliability of Lead-Free Solder Joints37 %
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee, John H Lau
Publisher: Springer
No Review Yet
₹15,360
₹9,677
Binding:
Hardback
Release:
30 May 2020
Language:
English
Available
Ships within 12-14 Days Explain..
8.
Heterogeneous Integrations37 %
Heterogeneous Integrations
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹14,400
₹9,072
Binding:
Hardback
Release:
12 Apr 2019
Language:
English
Available
Ships within 12-14 Days Explain..
9.
Fan-Out Wafer-Level Packaging37 %
Fan-Out Wafer-Level Packaging
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹9,600
₹6,048
Binding:
Paperback
Release:
16 Dec 2018
Language:
English
Available
Ships within 12-14 Days Explain..
10.
Fan-Out Wafer-Level Packaging37 %
Fan-Out Wafer-Level Packaging
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹13,440
₹8,467
Binding:
Hardback
Release:
10 May 2018
Language:
English
Available
Ships within 12-14 Days Explain..
11.
Solder Joint Reliability37 %
Solder Joint Reliability
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹19,200
₹12,096
Binding:
Hardback
Release:
31 May 1991
Language:
English
Available
Ships within 12-14 Days Explain..
12.
Solder Joint Reliability37 %
Solder Joint Reliability
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹19,200
₹12,096
Binding:
Paperback
Release:
23 Feb 2014
Language:
English
Available
Ships within 12-14 Days Explain..
13.
Advanced MEMS Packaging48 %
Advanced MEMS Packaging
By: John H. Lau, Cheng Kuo Lee, C.S. Premachandran, John Lau, Cheng Lee
Publisher: McGraw-Hill Education
No Review Yet
₹15,699
₹8,163
Binding:
Hardback
Release:
01 Nov 2009
Language:
English
Available
Ships within 1-2 Days Explain..
14.
Chip on Board37 %
Chip on Board
By: John H Lau
Publisher: Springer
No Review Yet
₹19,200
₹12,096
Binding:
Hardback
Release:
30 Jun 1994
Language:
English
Available
Ships within 12-14 Days Explain..
15.
Mechanics of Solder Alloy Interconnects37 %
Mechanics of Solder Alloy Interconnects
By: John H Lau, Darrel R Frear, Harold S Morgan, Steven N Burchett
Publisher: Springer
No Review Yet
₹19,200
₹12,096
Binding:
Hardback
Release:
31 Jan 1994
Language:
English
Available
Ships within 12-14 Days Explain..
16.
Handbook of Tape Automated Bonding37 %
Handbook of Tape Automated Bonding
By: John H Lau
Publisher: Springer
No Review Yet
₹19,200
₹12,096
Binding:
Hardback
Release:
31 Jan 1992
Language:
English
Available
Ships within 12-14 Days Explain..
17.
Through-Silicon Vias for 3D Integration48 %
Through-Silicon Vias for 3D Integration
By: John Lau, John H Lau
Publisher: McGraw-Hill Education
No Review Yet
₹14,208
₹7,388
Binding:
Hardback
Release:
11 Oct 2012
Language:
English
Available
Ships within 1-2 Days Explain..
18.
Reliability of RoHS-Compliant 2D and 3D IC Interconnects48 %
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
By: John Lau, John H Lau
Publisher: McGraw-Hill Education
No Review Yet
₹12,805
₹6,659
Binding:
Hardback
Release:
22 Dec 2010
Language:
English
Available
Ships within 1-2 Days Explain..
19.
Chiplet Design and Heterogeneous Integration PackagingNR
Chiplet Design and Heterogeneous Integration Packaging
By: Lau John H. Lau
Publisher: Springer Nature B.V.
No Review Yet
₹4,361
Binding:
Paperback
Release:
28 Mar 2023
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
20.
3D IC Integration and PackagingPOD/NR
3D IC Integration and Packaging
By: John Lau, John H Lau
Publisher: McGraw-Hill Education
No Review Yet
₹19,582
Binding:
Hardback
Release:
27 Aug 2015
Language:
English
International Edition
Ships within 16-18 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
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