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John H Lau

John H LauJohn Lau, Ph.D., is both an ASME and an IEEE fellow. He has written 17engineering books, published more than 425 peer-reviewed papers, and given 290lectures, workshops, and keynotes worldwide.

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1.
Chiplet Design and Heterogeneous Integration Packaging37 %
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau, John H Lau
Publisher: Springer Nature Singapore
No Review Yet
₹11,160
₹7,031
Binding:
Paperback
Release:
29 Mar 2024
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology43 %
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
By: John H. Lau, John H Lau
Publisher: Springer Nature Singapore
No Review Yet
₹15,844
₹9,031
Binding:
Hardback
Release:
18 Aug 2024
Language:
English
Available
Ships within 2-4 Days Explain..
3.
Chiplet Design and Heterogeneous Integration Packaging37 %
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau, John H Lau
Publisher: Springer Nature Singapore
No Review Yet
₹15,810
₹9,960
Binding:
Hardback
Release:
28 Mar 2023
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Semiconductor Advanced Packaging39 %
Semiconductor Advanced Packaging
By: John H. Lau, John H Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹10,230
₹6,240
Binding:
Paperback
Release:
19 May 2022
Language:
English
In Stock
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5.
Semiconductor Advanced Packaging37 %
Semiconductor Advanced Packaging
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹14,880
₹9,374
Binding:
Hardback
Release:
02 Aug 2021
Language:
English
Available
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6.
Assembly and Reliability of Lead-Free Solder Joints37 %
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee, John H Lau
Publisher: Springer
No Review Yet
₹10,695
₹6,738
Binding:
Paperback
Release:
13 Jun 2021
Language:
English
Available
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7.
Assembly and Reliability of Lead-Free Solder Joints37 %
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee, John H Lau
Publisher: Springer
No Review Yet
₹14,880
₹9,374
Binding:
Hardback
Release:
30 May 2020
Language:
English
Available
Ships within 12-14 Days Explain..
8.
Heterogeneous Integrations37 %
Heterogeneous Integrations
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹13,950
₹8,789
Binding:
Hardback
Release:
12 Apr 2019
Language:
English
Available
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9.
Fan-Out Wafer-Level Packaging37 %
Fan-Out Wafer-Level Packaging
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹9,300
₹5,859
Binding:
Paperback
Release:
16 Dec 2018
Language:
English
Available
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10.
Fan-Out Wafer-Level Packaging37 %
Fan-Out Wafer-Level Packaging
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹13,020
₹8,203
Binding:
Hardback
Release:
10 May 2018
Language:
English
Available
Ships within 12-14 Days Explain..
11.
Solder Joint Reliability37 %
Solder Joint Reliability
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹18,600
₹11,718
Binding:
Paperback
Release:
23 Feb 2014
Language:
English
Available
Ships within 12-14 Days Explain..
12.
Solder Joint Reliability37 %
Solder Joint Reliability
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹18,600
₹11,718
Binding:
Hardback
Release:
31 May 1991
Language:
English
Available
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13.
Advanced MEMS Packaging48 %
Advanced MEMS Packaging
By: John H. Lau, Cheng Kuo Lee, C.S. Premachandran, John Lau, Cheng Lee
Publisher: McGraw-Hill Education
No Review Yet
₹16,057
₹8,350
Binding:
Hardback
Release:
01 Nov 2009
Language:
English
Available
Ships within 1-2 Days Explain..
14.
Mechanics of Solder Alloy Interconnects37 %
Mechanics of Solder Alloy Interconnects
By: John H Lau, Darrel R Frear, Harold S Morgan, Steven N Burchett
Publisher: Springer
No Review Yet
₹18,600
₹11,718
Binding:
Hardback
Release:
31 Jan 1994
Language:
English
Available
Ships within 12-14 Days Explain..
15.
Chip on Board37 %
Chip on Board
By: John H Lau
Publisher: Springer
No Review Yet
₹18,600
₹11,718
Binding:
Hardback
Release:
30 Jun 1994
Language:
English
Available
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16.
Handbook of Tape Automated Bonding37 %
Handbook of Tape Automated Bonding
By: John H Lau
Publisher: Springer
No Review Yet
₹18,600
₹11,718
Binding:
Hardback
Release:
31 Jan 1992
Language:
English
Available
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17.
Through-Silicon Vias for 3D Integration48 %
Through-Silicon Vias for 3D Integration
By: John Lau, John H Lau
Publisher: McGraw-Hill Education
No Review Yet
₹14,532
₹7,557
Binding:
Hardback
Release:
11 Oct 2012
Language:
English
Available
Ships within 1-2 Days Explain..
18.
Reliability of RoHS-Compliant 2D and 3D IC Interconnects48 %
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
By: John Lau, John H Lau
Publisher: McGraw-Hill Education
No Review Yet
₹13,097
₹6,810
Binding:
Hardback
Release:
22 Dec 2010
Language:
English
Available
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19.
3D IC Integration and PackagingPOD/NR
3D IC Integration and Packaging
By: John Lau, John H Lau
Publisher: McGraw-Hill Education
No Review Yet
₹20,260
Binding:
Hardback
Release:
27 Aug 2015
Language:
English
International Edition
Ships within 16-18 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
20.
Building Leadership Bridges Book Set (2015-2019)35 %
Building Leadership Bridges Book Set (2015-2019)
By: Matthew Sowcik, Jean Lau Chin, Seana Lowe Steffen, H. Eric Schockman, John Eric Baugher
Publisher: Emerald Publishing Limited
No Review Yet
₹27,368
₹17,789
Binding:
SA
Release:
10 Aug 2020
Language:
English
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