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Jing (Tsinghua Univ, China) Liu

Jing (Tsinghua Univ, China) Liu

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Advanced Liquid Metal Cooling for Chip, Device and SystemNR
Advanced Liquid Metal Cooling for Chip, Device and System
By: , Jing Liu, Jing (Tsinghua Univ, China) Liu
Publisher: World Scientific Publishing Co Pte Ltd
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₹18,368
Binding:
Hardback
Release:
08 May 2022
Language:
English
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