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H. Lau

H. Lau

72 results found
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1.
Multiscale Global Monsoon SystemNR
Multiscale Global Monsoon System
By: Chih-Pei Chang, Daehyun Kim, Richard H Johnson, Bin Wang, Gabriel Ngar Lau
Publisher: World Scientific Publishing Company
No Review Yet
₹18,945
Binding:
Hardback
Release:
25 Feb 2021
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
2.
Esther34 % POD/NR
Esther
By: Peter H W Lau
Publisher: Langham Partnership International
No Review Yet
₹2,436
₹1,608
Binding:
Hardback
Release:
30 Sep 2018
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
3.
Chiplet Design and Heterogeneous Integration Packaging37 %
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau, John H Lau
Publisher: Springer Nature Singapore
No Review Yet
₹11,520
₹7,258
Binding:
Paperback
Release:
29 Mar 2024
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Your System's Sweetspots1 % NR
Your System's Sweetspots
By: Warren H Lau, Warren H Lau
Publisher: Draft2digital
No Review Yet
₹2,016
₹1,996
Binding:
Paperback
Release:
27 Mar 2023
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
5.
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology37 %
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
By: John H. Lau, John H Lau
Publisher: Springer Nature Singapore
No Review Yet
₹16,320
₹10,282
Binding:
Hardback
Release:
18 Aug 2024
Language:
English
Available
Ships within 12-14 Days Explain..
6.
Chiplet Design and Heterogeneous Integration Packaging37 %
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau, John H Lau
Publisher: Springer Nature Singapore
No Review Yet
₹16,320
₹10,282
Binding:
Hardback
Release:
28 Mar 2023
Language:
English
Available
Ships within 12-14 Days Explain..
7.
Semiconductor Advanced Packaging38 %
Semiconductor Advanced Packaging
By: John H. Lau, John H Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹10,454
₹6,481
Binding:
Paperback
Release:
19 May 2022
Language:
English
In Stock
Ships within 1-2 Days Explain..
8.
Semiconductor Advanced Packaging37 %
Semiconductor Advanced Packaging
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹15,360
₹9,677
Binding:
Hardback
Release:
02 Aug 2021
Language:
English
Available
Ships within 12-14 Days Explain..
9.
Assembly and Reliability of Lead-Free Solder Joints37 %
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee, John H Lau
Publisher: Springer
No Review Yet
₹11,040
₹6,955
Binding:
Paperback
Release:
13 Jun 2021
Language:
English
Available
Ships within 12-14 Days Explain..
10.
Assembly and Reliability of Lead-Free Solder Joints37 %
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee, John H Lau
Publisher: Springer
No Review Yet
₹15,360
₹9,677
Binding:
Hardback
Release:
30 May 2020
Language:
English
Available
Ships within 12-14 Days Explain..
11.
Heterogeneous Integrations37 %
Heterogeneous Integrations
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹14,400
₹9,072
Binding:
Hardback
Release:
12 Apr 2019
Language:
English
Available
Ships within 12-14 Days Explain..
12.
Fan-Out Wafer-Level Packaging37 %
Fan-Out Wafer-Level Packaging
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹9,600
₹6,048
Binding:
Paperback
Release:
16 Dec 2018
Language:
English
Available
Ships within 12-14 Days Explain..
13.
Fan-Out Wafer-Level Packaging37 %
Fan-Out Wafer-Level Packaging
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹13,440
₹8,467
Binding:
Hardback
Release:
10 May 2018
Language:
English
Available
Ships within 12-14 Days Explain..
14.
Banach Spaces of Continuous Functions as Dual Spaces37 %
Banach Spaces of Continuous Functions as Dual Spaces
By: H G Dales, H. G. Dales, D. Strauss, Jr., F.K. Dashiell, A.T.-M. Lau
Publisher: Springer
No Review Yet
₹8,160
₹5,141
Binding:
Paperback
Release:
07 Jul 2018
Language:
English
Available
Ships within 12-14 Days Explain..
15.
Numerical Library in C for Scientists and Engineers47 %
Numerical Library in C for Scientists and Engineers
By: H. T. Lau, Hang T. Lau, Hang T. (McGill University Lau, Hang T Lau, Hang T. (McGill University, Montreal, Quebec, Canada) Lau
Publisher: Taylor & Francis Inc
No Review Yet
₹17,760
₹9,413
Binding:
Hardback
Release:
23 Nov 1994
Language:
English
Available
Ships within 12-14 Days Explain..
16.
Solder Joint Reliability37 %
Solder Joint Reliability
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹19,200
₹12,096
Binding:
Paperback
Release:
23 Feb 2014
Language:
English
Available
Ships within 12-14 Days Explain..
17.
Solder Joint Reliability37 %
Solder Joint Reliability
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹19,200
₹12,096
Binding:
Hardback
Release:
31 May 1991
Language:
English
Available
Ships within 12-14 Days Explain..
18.
Advanced MEMS Packaging48 %
Advanced MEMS Packaging
By: John H. Lau, Cheng Kuo Lee, C.S. Premachandran, John Lau, Cheng Lee
Publisher: McGraw-Hill Education
No Review Yet
₹15,609
₹8,117
Binding:
Hardback
Release:
01 Nov 2009
Language:
English
Available
Ships within 1-2 Days Explain..
19.
Handbook of Tape Automated Bonding37 %
Handbook of Tape Automated Bonding
By: John H Lau
Publisher: Springer
No Review Yet
₹19,200
₹12,096
Binding:
Hardback
Release:
31 Jan 1992
Language:
English
Available
Ships within 12-14 Days Explain..
20.
Chip on Board48 %
Chip on Board
By: John H Lau
Publisher: Springer
No Review Yet
₹20,315
₹10,564
Binding:
Hardback
Release:
30 Jun 1994
Language:
English
Available
Ships within 1-2 Days Explain..
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