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E.J. Rymaszewski

E.J. Rymaszewski

6 results found
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1.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala
Publisher: Springer
No Review Yet
₹19,200
₹12,096
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala
Publisher: Springer
No Review Yet
₹14,400
₹9,072
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 12-14 Days Explain..
3.
Microelectronics Packaging Handbook3 % POD/NR
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, R R Tummala
Publisher: Springer
No Review Yet
₹33,749
₹32,737
Binding:
Paperback
Release:
31 Jan 1997
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
4.
Microelectronics Packaging Handbook19 % NR
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, I. Turlik
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹7,099
₹5,750
Binding:
Hardcover
Release:
01 Jan 1996
Language:
English
Out of Stock
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5.
Microelectronics Packaging Handbook9 % NR
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Rao R. Tummala, Eugene J. Pymaszewski
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹6,840
₹6,228
Binding:
Hardback
Release:
15 Sep 1996
Out of Stock
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6.
Microelectronics Packaging Fundamentals19 % NR
Microelectronics Packaging Fundamentals
By: R. R. Tummala, E.J. Rymaszewski, Rao R. Tummala, A.G. Klopfenstein
Publisher: Chapman and Hall
No Review Yet
₹5,423
₹4,393
Binding:
Hardback
Release:
01 Mar 1998
Out of Stock
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