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1.
Fundamentals of Lead-Free Solder Interconnect Technology37 %
Fundamentals of Lead-Free Solder Interconnect Technology
By: Tae-Kyu Lee, Choong-Un Kim, Thomas R. Bieler , Hongtao Ma, Thomas R Bieler
Publisher: Springer
No Review Yet
₹9,300
₹5,859
Binding:
Paperback
Release:
01 Oct 2016
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Fundamentals of Lead-Free Solder Interconnect Technology37 %
Fundamentals of Lead-Free Solder Interconnect Technology
By: Tae-Kyu Lee, Choong-Un Kim, Thomas R. Bieler , Hongtao Ma, Thomas R Bieler
Publisher: Springer
No Review Yet
₹9,300
₹5,859
Binding:
Hardback
Release:
01 Dec 2014
Language:
English
Available
Ships within 12-14 Days Explain..
3.
Electromigration in Thin Films and Electronic Devices5 % POD/NR
Electromigration in Thin Films and Electronic Devices
By: C-U Kim, Choong-Un Kim, Choong-Un (University of Texas at Arlington, USA) Kim
Publisher: Woodhead Publishing
No Review Yet
₹21,675
₹20,591
Binding:
Paperback
Release:
19 Aug 2016
Language:
English
International Edition
Ships within 14-16 Days Explain..
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Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
4.
Electromigration in Thin Films and Electronic Devices26 %
Electromigration in Thin Films and Electronic Devices
By: C. U. Kim, Choong-Un (EDT) Kim, C-U Kim
Publisher: Elsevier Science & Technology
No Review Yet
₹17,162
₹12,700
Binding:
Hardcover
Release:
28 Aug 2011
Language:
English
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