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1.
Electronic Packaging Materials Science VI: Volume 264NR
Electronic Packaging Materials Science VI: Volume 264
By: Che-Yu Li, Che-Yu (Cornell University, New York) Li, Paul S. (University of Texas, Austin) Ho, Kenneth A. (University of Arizona) Jackson, G. Ferris Lipscomb
Publisher: Materials Research Society
No Review Yet
₹2,172
Binding:
Hardback
Release:
12 Nov 1992
Language:
English
Out of Stock
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2.
Advanced Electronic Packaging Materials: Volume 167NR
Advanced Electronic Packaging Materials: Volume 167
By: Che-Yu Li, Andrew T. Barfknecht, Che-Yu (Cornell University, New York) Li, C Julian Chen, Andrew T Barfknecht
Publisher: Materials Research Society
No Review Yet
₹2,175
Binding:
Hardback
Release:
11 Apr 1990
Language:
English
Out of Stock
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3.
Stress-Induced Phenomena in MetallizationNR
Stress-Induced Phenomena in Metallization
By: John Sanchez, Che-Yu Li, John Bravman, Paul S Ho
Publisher: American Institute of Physics
No Review Yet
₹12,315
Binding:
Hardback
Release:
15 Apr 1998
Language:
English
Out of Stock
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4.
Stress-Induced Phenomena in MetallizationNR
Stress-Induced Phenomena in Metallization
By: Paul Totta, Paul Tuha, Che-Yu Li, C y Li, Paul S Ho
Publisher: American Institute of Physics
No Review Yet
₹10,585
Binding:
Hardback
Release:
14 Apr 2000
Language:
English
Out of Stock
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