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C.P. Wong (Editor)

C.P. Wong (Editor)

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1.
Advanced Flip Chip Packaging37 %
Advanced Flip Chip Packaging
By: Yi-Shao Lai, C.P. Wong, Ho-Ming Tong (Editor), Yi-Shao Lai (Editor)‎, C.P. Wong (Editor)
Publisher: Springer
No Review Yet
₹14,354
₹9,043
Binding:
Paperback
Release:
23 Aug 2016
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging37 %
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
By: Y.C. Lee, C.P. Wong, Ephraim Suhir, C.P. Wong (Editor), Ephraim Suhir (Editor)
Publisher: Springer
No Review Yet
₹48,000
₹30,240
Binding:
Paperback
Release:
23 Aug 2016
Language:
English
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