Humburger Icon
Logo1
Login & Sign up
Bookswagon-24x7 online bookstore
AddBanner
Home icon Home
Account Icon Account
Wishlist Icon Wishlist
Cart Icon Cart
Bookswagon icon Categories
Close

Refine your Search

By Price

Availability

Shipping Time

Source

Binding

Language

Publication Year

Filter By Category
B Keser

B Keser

2 results found
List viewGrid view
Sort By:
1.
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces29 % NR
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
By: Beth Keser, Steffen Kroehnert, Steffen Kröhnert, B Keser
Publisher: John Wiley and Sons Ltd
No Review Yet
₹13,270
₹9,422
Binding:
Hardback
Release:
04 Jan 2022
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
2.
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies10 % POD/NR
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
By: Beth Keser, Steffen Kroehnert, Steffen Kröhnert, Keser, B Keser
Publisher: Wiley-IEEE Press
No Review Yet
₹12,690
₹11,421
Binding:
Hardback
Release:
12 Feb 2019
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
No more records found