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Avram Bar Cohen

Avram Bar Cohen

18 results found
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1.
Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set)49 %
Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set)
By: Avram Bar-Cohen, Andrew Tay, Jeffrey C Suhling, Andrew A O Tay
Publisher: World Scientific Publishing Company
No Review Yet
₹1,18,395
₹60,381
Binding:
Hardback
Release:
18 Oct 2019
Language:
English
Available
Ships within 1-2 Days Explain..
2.
Encyclopedia of Thermal Packaging, Set 3: Thermal Packaging Applications (a 3-Volume Set)50 %
Encyclopedia of Thermal Packaging, Set 3: Thermal Packaging Applications (a 3-Volume Set)
By: Avram Bar-Cohen
Publisher: World Scientific Publishing Company
No Review Yet
₹1,05,240
₹52,620
Binding:
Hardback
Release:
15 Dec 2018
Language:
English
In Stock
Ships within 1-2 Days Explain..
3.
Advances in Thermal Modeling of Electronic Components and Systems, Volume 4
Advances in Thermal Modeling of Electronic Components and Systems, Volume 4
By: Avram Bar Cohen, Allan D Kraus
Publisher: American Society of Mechanical Engineers
No Review Yet
₹5,691
Binding:
Hardback
Release:
01 Jan 1998
Language:
English
Available
Ships within 4-6 Days Explain..
4.
Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools (a 4-Volume Set)49 %
Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools (a 4-Volume Set)
By: Avram Bar-Cohen
Publisher: World Scientific Publishing Company
No Review Yet
₹1,38,566
₹70,669
Binding:
Digital (delivered electronically)
Release:
01 Dec 2014
Language:
English
Available
Ships within 1-2 Days Explain..
5.
Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set)49 %
Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set)
By: Avram Bar-Cohen
Publisher: World Scientific Publishing Company
No Review Yet
₹1,38,566
₹70,669
Binding:
Hardback
Release:
28 Sep 2012
Language:
English
Available
Ships within 1-2 Days Explain..
6.
Embedded Cooling of Electronic Devices: Conduction, Evaporation, and Single- And Two-Phase ConvectionNR
Embedded Cooling of Electronic Devices: Conduction, Evaporation, and Single- And Two-Phase Convection
By: Madhusudan Iyengar, Avram Bar-Cohen, Justin A Weibel, Mehdi Asheghi, Justin a Weibel Meh Madhusudan Iyengar
Publisher: World Scientific Publishing Company
No Review Yet
₹13,326
Binding:
Hardback
Release:
29 Oct 2023
Language:
English
International Edition
Ships within 16-18 Days Explain..
Free Shipping in India and low cost Worldwide.
7.
Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 3: Compact Thermal Models of Electronic ComponentsNR
Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 3: Compact Thermal Models of Electronic Components
By: Clemens Lasance, Avram Bar-Cohen, Mohammed-Nabil Sabry
Publisher: World Scientific Publishing Company
No Review Yet
₹46,106
Binding:
Hardback
Release:
18 Dec 2014
Language:
English
International Edition
Ships within 16-18 Days Explain..
Free Shipping in India and low cost Worldwide.
8.
Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 2: Energy Optimization and Thermal Management of Data Centers4 % NR
Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 2: Energy Optimization and Thermal Management of Data Centers
By: Emad Samadiani, Dereje Agonafer, Yogendra Joshi, Avram Bar-Cohen, Bahgat G Sammakia
Publisher: World Scientific Publishing Company
No Review Yet
₹35,263
₹33,852
Binding:
Hardback
Release:
18 Dec 2014
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
9.
Design and Analysis of Heat Sinks15 % POD/NR
Design and Analysis of Heat Sinks
By: Allan D. Kraus, Allan D Kraus, Avram Bar-Cohen, AD Kraus, Allan D. (Allan D. Kraus Associates, Pacific Grove, CA) Kraus
Publisher: Wiley-Interscience
No Review Yet
₹17,336
₹14,736
Binding:
Hardback
Release:
03 Oct 1995
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
10.
Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 4: Thermally-Informed Design of Microelectronic ComponentsNR
Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 4: Thermally-Informed Design of Microelectronic Components
By: Sachin Sapatnekar, Bing Shi, Avram Bar-Cohen, Ankur Srivastava, Yufu Zhang
Publisher: World Scientific Publishing Company
No Review Yet
₹22,342
Binding:
Hardback
Release:
18 Dec 2014
Language:
English
International Edition
Ships within 16-18 Days Explain..
Free Shipping in India and low cost Worldwide.
11.
Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 6: Experimental Thermofluid Characterization of Electronic Components25 % NR
Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 6: Experimental Thermofluid Characterization of Electronic Components
By: Gary Solbrekken, Avram Bar-Cohen
Publisher: World Scientific Publishing Company
No Review Yet
₹23,655
₹17,703
Binding:
Hardback
Release:
04 Feb 2013
Language:
English
Out of Stock
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12.
Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 2: Air- And Liquid-Cooled Cold Plates25 % NR
Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 2: Air- And Liquid-Cooled Cold Plates
By: Allan Kraus, Avram Bar-Cohen
Publisher: World Scientific Publishing Company
No Review Yet
₹22,040
₹16,499
Binding:
Hardback
Release:
04 Feb 2013
Language:
English
Out of Stock
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13.
Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 3: Dielectric Liquid Cooling of Immersed Components25 % NR
Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 3: Dielectric Liquid Cooling of Immersed Components
By: Karl J L Geisler, Avram Bar-Cohen
Publisher: World Scientific Publishing Company
No Review Yet
₹25,270
₹18,907
Binding:
Hardback
Release:
04 Feb 2013
Language:
English
Out of Stock
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14.
Advances in Thermal Modeling of Electronic Components and Systems, Volume 236 % NR
Advances in Thermal Modeling of Electronic Components and Systems, Volume 2
By: Allan D Kraus, Avram Bar-Cohen
Publisher: American Society of Mechanical Engineers
No Review Yet
₹10,230
₹6,547
Binding:
Hardback
Release:
01 Jan 1990
Language:
English
Out of Stock
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15.
New Developments in Heat Exchangers12 % NR
New Developments in Heat Exchangers
By: N. Afgan, Maria da Graca Carvalho, N Afgan, Avram Bar-Cohen, D. Butterworth
Publisher: CRC Press
No Review Yet
₹24,180
₹21,163
Binding:
Hardback
Release:
03 Dec 1996
Language:
English
Out of Stock
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16.
Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 4: Thermoelectric Microcoolers14 % NR
Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 4: Thermoelectric Microcoolers
By: Bao Yang, Peng Wang, Avram Bar-Cohen, Peng (Univ Of Maryland, Usa) Wang, Bao (Univ Of Maryland, Usa) Yang
Publisher: World Scientific Publishing Company
No Review Yet
₹22,040
₹18,857
Binding:
Hardback
Release:
04 Feb 2013
Language:
English
Out of Stock
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17.
Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 5: Energy Efficient Solid State Lighting25 % NR
Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 5: Energy Efficient Solid State Lighting
By: Mehmet Arik, Anant Setlur, Avram Bar-Cohen, Joseph J Shiang, Stanton Weaver Jr
Publisher: World Scientific Publishing Company
No Review Yet
₹18,905
₹14,163
Binding:
Hardback
Release:
04 Feb 2013
Language:
English
Out of Stock
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18.
Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 1: Microchannel Heat Sinks for Electronics Cooling14 % NR
Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 1: Microchannel Heat Sinks for Electronics Cooling
By: Tannaz Harirchian, Suresh V Garimella, Avram Bar-Cohen, Suresh V (Purdue Univ, Usa) Garimella, Tannaz (Purdue Univ, Usa) Harirchian
Publisher: World Scientific Publishing Company
No Review Yet
₹22,040
₹18,857
Binding:
Hardback
Release:
04 Feb 2013
Language:
English
Out of Stock
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