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Amandeep Singh Sappal

Amandeep Singh Sappal

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Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds5 % POD/NR
Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds
By: Harjinder Singh, Amandeep Singh Sappal, Manvinder Sharma, Dr Harjinder Singh, Dr Amandeep Singh Sappal
Publisher: KS Omniscriptum Publishing
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₹3,257
₹3,094
Binding:
Paperback
Release:
19 Jun 2018
Language:
English
International Edition
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Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
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